Auto PCB stencil Solder Paste Screen Printer

Total System Alignment

± 10 microns (at 6Sigma)

Wet print capability

± 25 microns (at 6Sigma)

Core Cycle Time

12secs+process

Maximum Print Area

850mm*(X)×500mm(Y)

Printer Construction

One piece optimised welded frame

ISCAN Machine Control

integrated circuit (IC)

Operating System

Windows 7 Standard embedded

Operator interface

Interface in English with HC Automation Copyright

Camera

CCD digital Camera for Remote coaxial vision system four way independent coaxial/ Geometry pattern match/Annular LED light source  FOV 6.4*4.8mm Automatic capture

Camera Positioning

Automatic capture

Squeegee Pressure Mechanism

Software controlled,motorised

Stencil Positioning

Semi-Auto-Load incorporating squeegee drip tray

Stencil Alignment

Motorised via actuators X,Y, and Theta

Under Stencil Cleaning

Interchangeable Under Stencil drops of rain type cleaning system , fully programmable with wet/dry/vacuum wipe and the system can be programmed combination of dry wipe, wipe with solvent (“wet wiping”length programmable within 850mm)

Vacuum Assist Under Stencil Cleaning

Programmable powerful vacuum suction

Squeegee

Clamped double trailing edge squeegee (1set included)

Machine Interface

Upline and downline SMEMA included

Connctivity

Standard networking and USB interface available

Tri Colour Beacon

Programmable with audible alarm

Documentation

Operator 、installation 、electrical Drawings ,On board technical manuals

Transport System

Specification

Transport Speed

100-1500mm/sec Programmable

Transport height

900±40mm

Type

Single piece with 3mm “U”type transport belts ,front rail fixed

ESD Compatibility

Transport belts and guides with surface resistivity between 10⁶ and 10ⁱⁱ ohms

Width Adjustment

Programmable motorized rear rail

Transport Direction

Left to right ,Right to left,Left to left, Right to right

Board Handling Size(minimum)

50mm(X)x100mm(Y)

Board Handling Size(maximum)

850mm(X)x500mm(Y)

Board Thickness

0.2mm to 6mm

Board Weight(maximum)

3kg

Board Warpage

＜1%（Based on diagonal length）

Board Fixture

At the bottom of the support, elastic side clamping, Z-direction tabletting , Optional centernest vacuum

Board Support Methods

Magnetic pins,Support blocks,manaul up-down table

Board Underside Clearance

Programmable 13mm (25mm option

Process Parameter

Specification

Print Pressure

0~30kg programmable

Print Speed

10~200mm/sec

Print Gap

0mm to 6mm

Air Pressure

4~6kg/cm²

Air Consumption

Around 0.007m³/min

Substrate Separation

Speed:0.1~125mm/sec Programmable with three step control

Print Modes

Print/Print Print/Flood Flood/Print Adhesive

Paste Knead

Programmable number period on demand

Vision

Specification

Vision System

beijing daheng

Fiducial Recognition

Image matching, mathematical algorithm

Fiducials

2 or 4

Fiducial Types

Standard geometry, reference point, pad / hole

Fiducial Size

0.1mm to 3mm

Fiducial Locations

Anywhere on substrate

Fiducial Error Reovery

Optical automatic adjustment , automatic search reference point

Camera Lighting

Program control LED brightness adjustment