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back grinding Wheel for inserts
China Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer
Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer.
Coolant: Oil, emulsion
workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin,ATM, Melchiorre, Peter Wolters, Diskus, Viotto, Wendt
Material of workpiece: monocrystalline silicon and some other semiconductor materials.
Specifications
1.be used with Japanese, German, American, Korea and Chinese grinders
2.superior grinding performance
3.high cost performance
Shape code |
Profile Sketch |
Conventional Specification (mm) |
||
Out diameter D |
Thickness T |
Hole diameter H |
||
6A2 |
175 |
30, 35 |
76 |
|
200 |
35 |
76 |
||
375 |
40 |
127 |
||
6A2T |
195 |
22.5, 25 |
170 |
|
280 |
30 |
228.6 |
||
350 |
35 |
235 |
||
6A2T- |
209 |
22.5 |
158 |
|
Application: back thinning, grinding and fine grinding.
The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.
Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM
If you need any products, do not hesitate to contact
Annamoresupe@gmail.com
@moresuperhard.com
WhatsApp:+8615617785923
Skype:Annawng
Wechat:15617785923
QQ:1664333593
Mobile:+86-156177854923
Tel/Fax:+86-0371-86545906
Send Inquiry to This Supplier
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