Copper Plating Solution Electroplating Copper Bath Electroplated Copper Phosphor
High-speed plating copper liquid
First, the product code: Q / YS.138 (Yi Shun brand)
Second, the performance of this product:
This product is suitable for rapid thickening of copper plating. The thick copper plating has bright and bright colors. The copper plating has good bonding force, small internal stress and dense copper plating. It can be widely used in thickening of various models. Such as: veins (diamond leaf)
Third, product index:
① appearance: blue transparent liquid, odorless.
② PH: .
③ proportion> 1.0.
Fourth, the use of methods:
① anodic access to pure copper, the cathode connection plating;
② anode area: cathode area = 2: 1
③ first adjust the current intensity to 1-2 amperes, with a small current plating 1-2 minutes, and then adjust the current intensity to 3-5 amps, plating thickening.
Fifth, note:
① midway to filter, remove impurities.
② do not pollute the bath.
③ anodic use of pure copper plate.
④ can barrel plating, you can also hang plating.
Our services
Order Guangzhou YiShun Chemical Company's products, you will have the following technical support: 1, selection of professional engineers. 2, phone detailed understanding.3, video demo. 4, live demonstrations. 5, site service.6, special technology R & D and preparation. 7, continue to follow the sale.
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