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New patented BGA rework stencils: MJ 3D BGA Reballing Stencil template, iPhone A8 A9 A10 groove Reballing Stencil Template, iphone 6/6 plus, iphone 6s/6s plus and iphone 7 /7plus 3D BGA Reballing Stencil template.
New patented groove BGA rework stencils: MJ 3D BGA Reballing Stencil template
New Style 3D BGA planting Stencil: Stepped groove / easy to use / Accuratea Lignment
1.Stepped groove design enables stencil to align with tinning position of IC rapidly.
2.The square holes design makes it easier to take out the formed solder balls.
3.This 3D stencil is easy to use no matter you are a new or expert.
4.High success rate of planting tin,the solder balls can be formed once after you are proficient.
5.This 3D planting stencil is thicker than ordinary stencils in the market .Less tendency of deformation makes its using life be longer.
groove (Automatic counterpoint) Reballing Stencil Template for iphone A8 A9 A10
groove Reballing Stencil Template
Optional 1: MJ 3D A8
Optional 2: MJ 3D A9
Optional 3: MJ 3D A10
MJ 3D A8: iphone 6/6 plus IC: Touch IC, Baseband, font IC, audio IC, power IC, A8 CPU
MJ 3D A9: iphone 6s/6s plus: Touch IC, Baseband, font IC, audio IC, power IC, A9 CPU
MJ 3D A10: iphone 7 /7plus: Touch IC, Baseband, font IC, audio IC, power IC, A10 CPU
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