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Home > Electrical & Electronics > Integrated Circuit > General-purpose Integrated Circuit > Non-Silicone Putty GEL Thermal Conductive Thermal Interface Material
Non-Silicone Putty GEL Thermal Conductive Thermal Interface Material
Negotiable
MOQ: 500 Pieces (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
GLPOLY
Place of Origin:
China
Model Number:
XK-GN20
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
7 days
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Brand Name
GLPOLY
Place of Origin
China
Model Number
XK-GN20
Introduction
Syringes packaging, automated production, high temperature, non-corrosive metal, 100% thermal curing putty. XK-GN series a high performance thermal Gel , it base on TPR, Filled with a variety of high-performance ceramic powder made. It also has a high thermal conductivity, low thermal resistance, in the heat sink affixed good. Good insulation can be infinitely compression characteristics.
Features
Have enough compressibility
Non-silicone
non-curing
Resists pump-out
Applications
Consumer electronics.
Automotive Systems.
Telecommunications.
Thermal Conductivity |
W/mK |
1.4 |
2 |
3 |
HOT DISK |
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Business Type
Trading Company
Total Employees
101 - 200 People
Main Markets
North America, South America, Eastern Europe
Location
Tai'an, Shandong, China
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