FR4 Double Side Multi-Layer PCB Board Assembly Immersion Gold Printed Circuit

Name: FR4 Double Side Multi-Layer PCB Board Assembly Immersion Gold Printed Circuit
Brand: SYF
Price: Negotiable

FOB Price

Negotiable / Piece

1 Piece(Min.Order)

Supply Ability 0 Piece / Pieces per Month
Payment Terms:T/T L/C D/P D/A
Delivery Detail:7 days

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Product Details

Brand Name:

SYF

Place of Origin:

China

Model Number:

SYF-256

Product Description

Delivery Time:6-8 DAYS
Certification:UL,ISO9001:2008,ROHS,REACH, HALOGEN FREE,SGS

FR4 Double Side Multi-Layer Immersion Gold Printed Circuit Board Assembly

PRODUCT’S DETAILS
Raw Material	FR-4 (Tg 180 available)
Layer Count	4-Layer
Board Thickness	1.0mm
Copper Thickness	2.0oz
Surface Finish	ENIG(Electroless Nickel Immersion Gold)
Solder Mask	Green
Silkscreen	White
Min. Trace Width/Spacing	0.075/0.075mm
Min. Hole Size	0.25mm
Hole Wall Copper Thickness	≥20μm
Measurement	300×400mm
Packaging	Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps
Application	Communication,automobile,cell,computer,medical
Advantage	Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements	Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable
Certification	UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB
PROCESS Engineer	ITEMS Item	PRODUCTION CAPABILITY Manufacturing Capability
Laminate	Type	FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON
Thickness	0.2～3.2mm
Production Type	Layer Count	2L-16L
Surface Treatment	HAL,Gold Plating,Immersion Gold,OSP, Immersion Silver,Immersion Tin,Lead Free HAL
Cut Lamination	Max. Working Panel size	1000×1200mm
Inner Layer	Internal Core Thickness	0.1～2.0mm
Internal width/spacing	Min: 4/4mil
Internal Copper Thickness	1.0~3.0oz
Dimension	Board Thickness Tolerance	±10%
Interlayer Alignment	±3mil
Drilling	Manufacture Panel Size	Max: 650×560mm
Drilling Diameter	≧0.25mm
Hole Diameter Tolerance	±0.05mm
Hole Position Tolerance	±0.076mm
Min.Annular Ring	0.05mm
PTH+Panel Plating	Hole Wall copper Thickness	≧20um
Uniformity	≧90%
Outer Layer	Track Width	Min: 0.08mm
Track Spacing	Min: 0.08mm
Pattern Plating	Finished Copper Thickness	1oz～3oz
EING/Flash Gold	Nickel Thickness	2.5um~5.0um
Gold Thickness	0.03~0.05um
Solder Mask	Thickness	15～35um
Solder Mask Bridge	3mil
Legend	Line width/Line spacing	6/6mil
Gold Finger	Nickel Thickness	≧120u〞
Gold Thickness	1～50u〞
Hot Air Level	Tin Thickness	100～300u〞
Routing	Tolerance of Dimension	±0.1mm
Slot Size	Min:0.4mm
Cutter Diameter	0.8～2.4mm
Punching	Outline Tolerance	±0.1mm
Slot Size	Min:0.5mm
V-CUT	V-CUT Dimension	Min:60mm
Angle	15°30°45°
Remain Thickness Tolerance	±0.1mm
Beveling	Beveling Dimension	30～300mm
Test	Testing Voltage	250V
Max.Dimension	540×400mm
Impedance Control	Tolerance	±10%
Aspect Ration	12:1
Laser Drilling Size

Contact Us

Shenzhen SYF Precision Electronics limited.: Contact nameMr. Bryant; Phone86-0755-29928869; AddressRoom801-805,7/Floor,Dehe Building,Shajing Town,Bao\'an District Yantai,Shandong

Product Categories

Circuit Board Assembly	Copper Clad PCB	Custom PCB Boards	Double Sided PCB
High-tg PCB	Multi Layer PCB	PCB Board Assembly	PCB Board Layout
PCB Printed Circuit Board	PCBA Board	Printed Circuit Board Assembly	Prototype PCB Board
Quick Turn PCB	Single Sided PCB	SMT PCB Assembly

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FR4 Double Side Multi-Layer PCB Board Assembly Immersion Gold Printed Circuit

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