Mini Size And High Sensitivity Infrared Thermal Imaging Module for TWS

Delivery Time:7days after received payment
Certification:CE, ISO9001:2000

Mini Size And High Sensitivity Infrared Thermal Imaging Module for TWS

JH010-320 Infrared Thermal Imaging Module for Light Weight TWS use the lastest uncooled  VOx focal plane array technology.  The extensible FPGA technology design can offer high speed hardware platform for image processing and pattern algorithm. Meanwhile, JH101-320 is suitable for OEM assembling and integration

FEATURES:

High sensitivity and image uniformity. Compact structure, small demension, light weight and low consumption. Adopt DNR, image DDE developed image processing and pattern algorithm. Standard optical interfaces ,easily for expansion, multi lenses optional. Environmental adaptation and reliable design can meet miltary and special system OEM design and production.

TECHNICAL SPECIFICATION
 

Detector
Detecor	Uncooled VOx Microbolometer
Pixel	320×256
Pitch	25μm×25μm
Spectral band	7.5μm～13.5μm
Fill factor	＞80%
Imaging Performance
N E T D	≤70mK (F/1)
Fame frequency	25Hz /30Hz
Video output	PAL/NTSC
Starting time	≤20s
Control Function
Communication interface	RS232
Brightness&Contrast	Automatic or manual
Digital zoom	2x
Polarity	WH/BH
Cross cursor	Display/hiding
Power System
Power supply	DC 12V ( DC 7～12V optional)
Power dissipation	≤1.6W@25℃
Environmental specification
Operating temperature	-40℃～+60℃
Storage temperature	-50℃～+70℃
Shock	30g,11ms±2ms half-sine wave
Vibration	1mm,or±4g
Physical Characteristics
Size	44.5mm(L)×44.5mm(W)×40mm(H)
Weight	Approx 65g (excluding lens)