Silicone thermal pad
1.Thermal Conductivity:2.5w/m.k
2.High Thermal Performance and cost effective
3.Use Japan ceramic
Silicone thermal pad
Features&Benefits:
1.High thermal conductivity
|
Typical Properties of Gap Pad LD8250 |
|||||||
| Property | Unit | Metric Value | Test Method | ||||
| Color | *** | Yellow | Visual | ||||
|
Thickness |
mm |
0.5-5.0 |
ASTM D374 |
||||
|
Density |
g/cc |
3.0 |
ASTM D792 |
||||
|
Hardness |
Shore C |
25±5 |
ASTM D2240 |
||||
|
Tensile Strength |
KN/m |
0.42 |
ASTM D412 |
||||
|
Continuous Use Temp. |
°C |
-40-150°C |
EN 344 |
||||
|
Electrical |
|||||||
|
Breakdown Voltage |
Kv/mm |
≥5.3 |
ASTM D149 |
||||
|
Volume Resistivity |
Ω.cm |
3.2×1016 |
ASTM D257 |
||||
|
Flame rating |
V-0 |
V-0 |
UL 94 |
||||
|
Thermal |
|||||||
|
Thermal Conductivity |
W/m.k |
2.5 |
ASTM D5470 |
||||
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