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Help CenterRigid 8 Layer Surface Mount SMT PCB Assembly , AutomaticOpticalInspection
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Certification:ISO/UL/RoHS
Rigid 8 Layer Surface Mount SMT PCB Assembly , Automatic Optical Inspection
Specifications
1. Our professional engineering team can put your project into production in a short time. Sample pictures and BOM are needed to make customized products
2. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured according to customers\' requests or samples. Plastic injection processing available.
3. We have advanced equipment for through-hole and SMT DIP COB cable assembly.
4. ROHS compliant and lead-free process.
5. In-circuit, functional tests& burn-in tests, full system test
6. High output to guarantee prompt delivery.
|
1 |
layer |
1-30 layer |
|
2 |
Material |
CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
|
3 |
Board thickness |
0.2mm-6mm |
|
4 |
Max.finished board size |
800*508mm |
|
5 |
Min.drilled hole size |
0.25mm |
|
6 |
min.line width |
0.075mm(3mil) |
|
7 |
min.line spacing |
0.075mm(3mil) |
|
8 |
Surface finish |
HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
|
9 |
Copper thickness |
0.5-4.0oz |
|
10 |
Solder mask color |
green/black/white/red/blue/yellow |
|
11 |
Inner packing |
Vacuum packing,Plastic bag |
|
12 |
Outer packing |
standard carton packing |
|
13 |
Hole tolerance |
PTH:±0.076,NTPH:±0.05 |
|
14 |
Certificate |
UL,ISO9001,ISO14001,ROHS,TS16949 |
|
15 |
Profiling punching |
Routing,V-CUT,Beveling |
PCB Assembly services:
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design
Testing Methods
AOI Testing
Checks for solder paste
Checks for components down to 0201\"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
Send Inquiry to This Supplier
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