Home > Products > Quick Turn PCB Prototypes > PCB Design And Fabrication 10 Layer Bga Tg170 Gold Finger Hole Size 0.2mm
PCB Design And Fabrication 10 Layer Bga Tg170 Gold Finger Hole Size 0.2mm
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Product Details
Brand Name: | ChiTunPCB | Place of Origin: | China | Model Number: | CTEL1010200 |
Product Description
Certification:UL/ISO/ROHS/SGS
PCB Design And Fabrication 10 Layer Bga Tg170 Gold Finger Hole Size 0.2mm
Product Description |
|
Model Number: |
CTEL1010200 |
Number of Layer: |
10Layer |
Material: |
FR4 tg170 |
Finish Thickness: |
2.4mm |
copper: |
1oz |
PCB Size : |
55*109mm |
Line Width/line space |
10/8mil |
Min.Hole size : |
0.2mm |
Surface finish : | Gold finger |
Green solder mask |
|
White sillkscreen |
|
Place of Origin: |
China |
Brand Name: |
ChiTun |
Certification: |
UL,ROHS,ISO |
Standard: |
IPC standard |
TECHNOLOGY:
. RoHS/ Lead Free
. HDI Microvias
. Blind Vias
. Buried Vias
. Selective Plating
. Impedance Control
Manufacturing Standard:
. IPC-A-600G Class II
. IPC-A-600G Class III
. PERFAG 2E for Double-Sided Board
. PERFAG 3C for Multilayer Board
Capability
Min. Finished Holes Size: 0.008\" (0.20mm)
Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)
Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)
Maximum copper thickness: 5oz (140um)
Thin board thickness:
. DS - 0.008 inches (0.20mm)
. 4/L - 0.016 (0.40mm)
. 6/L - 0.020 inches (0.60mm)
Maximum board thickness:
. 275.8mil (7.0mm)
Surface treatment:
. HASL/lead free HAL/gold plating
. Immersion gold
. Immersion tin
. Immersion silver
. Gold fingers (hard gold)
. OSP
Contact Us
- Chi Tun Electronics Co.,Ltd
- Contact nameMr. Zhang
- Phone86-755-29639796
- AddressNo. 1,Area B, Huameiju business industry park ,82Dis.baoan Tai'an,Shandong
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