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Home > Electrical & Electronics > Integrated Circuit > General-purpose Integrated Circuit > Quick Turn Pcb Prototypes For Mobile Phone Circuit Board 8 Layer Surface Osp With Fr4 It180 1.2mm
Quick Turn Pcb Prototypes For Mobile Phone Circuit Board 8 Layer Surface Osp With Fr4 It180 1.2mm
Negotiable
MOQ: 1 Piece (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
CHITUN
Place of Origin:
China
Model Number:
base on customers\' requestion
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
7 days
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Brand Name
CHITUN
Place of Origin
China
Model Number
base on customers\' requestion
Delivery Time:15-20 days
Certification:UL/ISO/ROHS/SGS
testing Supercomputing
Certification:UL/ISO/ROHS/SGS
Quick Turn Pcb Prototypes For Mobile Phone Circuit Board 8 Layer Surface Osp With Fr4 It180 1.2mm
High Density Interconnect (HDI) Boards
HDI is used widely in the following areas:
Chip Packaging
Next-Generation SiliconChiTun is a China based manufacturer of High Density Interconnect PCBs (HDI PCBs). Our HDI capabilities include laser microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology. We have provided microelectronic pcbs with fine pitch devices down to 200 microns, using laser drilled via-in-pad technology and thin build-up materials.
testing Supercomputing
Upload your data and receive a free consultation and review of your HDI design today or contact us if you need any design help. Experience our expertise and feel the difference.
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Business Type
Trading Company
Total Employees
101 - 200 People
Main Markets
North America, South America, Eastern Europe
Location
Weinan, Shaanxi, China
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