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PCB Design And Fabrication 10 Layer Bga Tg170 Gold Finger Hole Size 0.2mm

Chi Tun Electronics Company
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Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
ChiTunPCB
Place of Origin:
China
Model Number:
CTEL1010200
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Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
7 days

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Brand Name ChiTunPCB
Place of Origin China
Model Number CTEL1010200
Delivery Time:10-30days
Certification:UL/ISO/ROHS/SGS

PCB Design And Fabrication 10 Layer  Bga Tg170 Gold Finger Hole Size 0.2mm

Product Description

Model Number:

CTEL1010200

Number of Layer:

10Layer

Material:

FR4 tg170

Finish  Thickness:

2.4mm

copper:

1oz

PCB Size :

55*109mm

Line Width/line space

10/8mil

Min.Hole size :

0.2mm

Surface finish : Gold finger
 

Green solder mask

White sillkscreen

Place of Origin:

China

Brand Name:

ChiTun

Certification:

UL,ROHS,ISO

Standard:

IPC  standard

TECHNOLOGY:

. RoHS/ Lead Free

. HDI Microvias

. Blind Vias

. Buried Vias

. Selective Plating

. Impedance Control

Manufacturing Standard:

. IPC-A-600G Class II

. IPC-A-600G Class III

. PERFAG 2E for Double-Sided Board

. PERFAG 3C for Multilayer Board

Capability

Min. Finished Holes Size: 0.008\" (0.20mm)

Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)

Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)

Maximum copper thickness: 5oz (140um)

Thin board thickness:

. DS - 0.008 inches (0.20mm)

. 4/L - 0.016 (0.40mm)

. 6/L - 0.020 inches (0.60mm)

Maximum board thickness:

. 275.8mil (7.0mm)

Surface treatment:

. HASL/lead free HAL/gold plating

. Immersion gold

. Immersion tin

. Immersion silver

. Gold fingers (hard gold)

. OSP

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Chi Tun Electronics Company
Business Type
Trading Company
Total Employees
101 - 200 People
Main Markets
North America, South America, Eastern Europe
Location
Weinan, Shaanxi, China
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