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Home > Industrial Equipment & Components > Industrial Ceramic Products > Ceramic Insulator > 10 Layer FR4 3.0mm Plating Gold Impedance Control Quick Turn PCB Prototypes HDI PCB

10 Layer FR4 3.0mm Plating Gold Impedance Control Quick Turn PCB Prototypes HDI PCB

Chi Tun Electronics Company

10 Layer FR4 3.0mm Plating Gold Impedance Control Quick Turn PCB Prototypes HDI PCB photo-1

Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)

Key Specifications

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Business Type:

Trading Company

Total Employees:

101 - 200 People

Main Markets:

North America, South America, Eastern Europe

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Payment & Shipping

Payment Methods:

Port of Shipment:

China

Delivery Detail:

7 days

Product Details
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Delivery Time:quick turn and normal type

10 Layer FR4 3.0mm Plating Gold Impedance Control Quick Turn PCB Prototypes HDI PCB

	Product Description
Model Number:	CTE-008
Number of Layer:	10layer
Material:	FR4 Tg170
Finish Thickness:	3.0mm
Finish copper:	2OZ
Surface Finish:	Plating gold
	Green solder mask
	White silkscreen
	CNC routing V-CUT
Place of Origin:	China
Brand Name:	CHITUN
Certification:	UL,ROHS,ISO
Standard:	IPC or base on customers\' requestion

24Hours for urgent 1-2layers ,

2-4days for multilayer PCBs .

24 hour turnaround time on double-sided PCB’s,
2-4 day turn available up to ten layers;

over ten layers can be done in one week.

To shorten the cycle time of new product introduction.

Applications(Target Market):

Cooling and Washing machine, Switching Power Amplifiers, Home Computer, Home Theater/Stereo Surround Sound System, Cable Television Converter Box, Hand Held Video Games, Digital and analog Switching, Remote control electronic toys, Disk Drive duplication systems, LOJACK auto recovery system, Electronic Television Audience Measurement Systems/Electronic Audience Measurement Systems,Headphone Systems ect.

Technology Capability

Feature	2015	2016	2017
Base Material	CEM1,CEM3, Middle-Tg FR4, High-Tg FR4, Halogen free, BT / Rogers / PTFE Aluminum base material	CEM1,CEM3, Middle-Tg FR4, High-Tg FR4, Halogen free, BT / Rogers / PTFE Aluminum base material	CEM1,CEM3, Middle-Tg FR4, High-Tg FR4, Halogen free, BT / Rogers / PTFE Aluminum base material
Max. Layer Count	24	30	32
Max. PCB Size (max.)	558mm X 660mm	558mm X 660mm	558mm X 660mm
Base copper	1/3 oz - - 5 oz	1/3 - - 5 oz	1/3 - - 5 oz
Copper thickness (outer)	6 oz	6 oz	6 oz
Max. Board Thickness mm (mil)	3.4 (134)	3.4 (134)	3.4 (134)
Min. Board Thickness mm (mil)	0.1 (4)	0.1 (4)	0.1 (4)
Min. Line Width / Spacing	Inner um (mil)	75/100 (3 4)	75/75 (3/3)	75/75 (3/3)
Outer um (mil)	100/100 (4/4)	75/75 (3/3)	75/75 (3/3)
Min. Mechanical Drill Size (mm)	0.2	0.2	0.2
Min. HWTC um (mil)	175 (7)	175 (7)	175 (7)
Min. Soldermask Opening um (mil)	50 (2)	50 (2)	50 (2)
Finest SMT Pitch mm