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Help CenterFlexiblePrinted Circuit Board SMT PCB Assembly 1 Layer - 30 Layer
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Certification:ISO/UL/RoHS
Flexible Printed Circuit Board SMT PCB Assembly 1 Layer - 30 Layer
Specifications
1. The high standard workshops for SMT, DIP, and Assembling ensure our strong processing capacity.
2. Abundant experience and strong ability in material sourcing, manufacturing, test and quality management.
3. Products in kinds of fields, such as Power, Communication equipment, remote control system, car DVD,
GPS navigation and consumer electronic products etc.
Welcome to Huaswin!
Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.
We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP
assembly ,IC pre-programming / burning on-line, testing, packing.
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
Detailed Specification of PCB Manufacturing
|
1 |
layer |
1-30 layer |
|
2 |
Material |
CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
|
3 |
Board thickness |
0.2mm-6mm |
|
4 |
Max.finished board size |
800*508mm |
|
5 |
Min.drilled hole size |
0.25mm |
|
6 |
min.line width |
0.075mm(3mil) |
|
7 |
min.line spacing |
0.075mm(3mil) |
|
8 |
Surface finish |
HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
|
9 |
Copper thickness |
0.5-4.0oz |
|
10 |
Solder mask color |
green/black/white/red/blue/yellow |
|
11 |
Inner packing |
Vacuum packing,Plastic bag |
|
12 |
Outer packing |
standard carton packing |
|
13 |
Hole tolerance |
PTH:±0.076,NTPH:±0.05 |
|
14 |
Certificate |
UL,ISO9001,ISO14001,ROHS,TS16949 |
|
15 |
Profiling punching |
Routing,V-CUT,Beveling |
PCB Assembly services:
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete \'Box Build\' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material
Testing Methods
AOI Testing
· Checks for solder paste
· Checks for components down to 0201\"
· Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
· BGAs
Send Inquiry to This Supplier
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