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Help CenterSurface Mount High TG 10 Layer PCB Quick Turn Printed Circuit Boards Assembly
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Certification:ISO/UL/RoHS
Surface Mount High TG 10 Layer PCB Quick Turn Printed Circuit Boards Assembly
Specifications
1. The high standard workshops for SMT, DIP, and Assembling ensure our strong processing capacity.
2. Abundant experience and strong ability in material sourcing, manufacturing, test and quality management.
3. Products in kinds of fields, such as Power, Communication equipment, remote control system, car DVD,
GPS navigation and consumer electronic products etc.
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
Detailed Specification of PCB Manufacturing
|
1 |
layer |
1-30 layer |
|
2 |
Material |
CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, |
|
3 |
Board thickness |
0.2mm-6mm |
|
4 |
Max.finished board size |
800*508mm |
|
5 |
Min.drilled hole size |
0.25mm |
|
6 |
min.line width |
0.075mm(3mil) |
|
7 |
min.line spacing |
0.075mm(3mil) |
|
8 |
Surface finish |
HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, |
|
9 |
Copper thickness |
0.5-4.0oz |
|
10 |
Solder mask color |
green/black/white/red/blue/yellow |
|
11 |
Inner packing |
Vacuum packing,Plastic bag |
|
12 |
Outer packing |
standard carton packing |
|
13 |
Hole tolerance |
PTH:±0.076,NTPH:±0.05 |
|
14 |
Certificate |
UL,ISO9001,ISO14001,ROHS,TS16949 |
|
15 |
Profiling punching |
Routing,V-CUT,Beveling |
PCB Assembly services:
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design
Detailed Specification of Pcb Assembly
|
1 |
Type of Assembly |
SMT and Thru-hole |
|
2 |
Solder Type |
Water Soluble Solder Paste,Leaded and Lead-Free |
|
3 |
Components |
Passives Down to 0201 Size |
|
BGA and VFBGA |
||
|
Leadless Chip Carries/CSP |
||
|
Double-Sided SMT Assembly |
||
|
Fine Pitch to 08 Mils |
||
|
BGA Repair and Reball |
||
|
Part Removal and Replacement-Same Day Service |
||
|
3 |
Bare Board Size |
Smallest:0.25x0.25 Inches |
|
Largest:20x20 Inches |
||
|
4 |
File Formats |
Bill of Materials |
|
G |
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