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Home > Electrical & Electronics > Passive Components > Resistor & Potentiometer > CEM 1 CEM 3 PCB 8 Layer Printed Circuit Board Assembly , EMS PCBA

CEM 1 CEM 3 PCB 8 Layer Printed Circuit Board Assembly , EMS PCBA

Name: CEM 1 CEM 3 PCB 8 Layer Printed Circuit Board Assembly , EMS PCBA
Brand: HUASWIN
SKU: 149711102
Availability: InStock

CEM 1 CEM 3 PCB 8 Layer Printed Circuit Board Assembly , EMS PCBA thumbnail-1

CEM 1 CEM 3 PCB 8 Layer Printed Circuit Board Assembly , EMS PCBA photo-1

Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)

Key Specifications

Get Latest Price

Brand Name:

HUASWIN

Place of Origin:

China

Model Number:

HSPCBA1002

Contact Supplier Request Quote Chat Now

Huaswin Electronics Company

Payment & Shipping

Payment Methods:

Port of Shipment:

China

Delivery Detail:

7 days

Product Details
Company Profile
Contact Us

Brand Name HUASWIN

Place of Origin China

Model Number HSPCBA1002

Delivery Time:15-20 working days
Certification:ISO/UL/RoHS

CEM 1 CEM 3 PCB 8 Layer Printed Circuit Board Assembly , EMS PCBA

Quick Detail:

UL,ROHS,SGS,ISO Layer: 1-30 layer Material:CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. min.line width:0.075mm(3mil) min.line spacing:0.075mm(3mil) Surface finish:HAL, HAL Lead free,Immersion Gold/ Silver/Tin,Hard Gold, OSP PCB/PCB Assembly manufacturing :OEM/ODM service

Detailed Specification of PCB Manufacturing

1	layer	1-30 layer
2	Material	CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
3	Board thickness	0.2mm-6mm
4	Max.finished board size	800*508mm
5	Min.drilled hole size	0.25mm
6	min.line width	0.075mm(3mil)
7	min.line spacing	0.075mm(3mil)
8	Surface finish	HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
9	Copper thickness	0.5-4.0oz
10	Solder mask color	green/black/white/red/blue/yellow
11	Inner packing	Vacuum packing,Plastic bag
12	Outer packing	standard carton packing
13	Hole tolerance	PTH:±0.076,NTPH:±0.05
14	Certificate	UL,ISO9001,ISO14001,ROHS,TS16949
15	Profiling punching	Routing,V-CUT,Beveling

Detailed Specification of Pcb Assembly

1	Type of Assembly	SMT and Thru-hole
2	Solder Type	Water Soluble Solder Paste,Leaded and Lead-Free
3	Components	Passives Down to 0201 Size
BGA and VFBGA
Leadless Chip Carries/CSP
Double-Sided SMT Assembly
Fine Pitch to 08 Mils
BGA Repair and Reball
Part Removal and Replacement-Same Day Service
3	Bare Board Size	Smallest:0.25x0.25 Inches
Largest:20x20 Inches
4	File Formats	Bill of Materials
Gerber Files
Pick-N-Place File(XYRS)
5	Type of Service	Turn-Key,Partial Turn-Key or Consignment
6	Component Packaging	Cut Tape
Tube
Reels
Loose Parts
7	Turn Time	15 to 20 days
8	Testing	AOI inspection
X-Ray inspection
In-Circuit testing
Functional test