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Home > Electrical & Electronics > Integrated Circuit > General-purpose Integrated Circuit > ISO9001 PTH BGA PCB Board Assembly / High TG PCB 2 Layer 4 Layer

ISO9001 PTH BGA PCB Board Assembly / High TG PCB 2 Layer 4 Layer

Name: ISO9001 PTH BGA PCB Board Assembly / High TG PCB 2 Layer 4 Layer
Brand: HUASWIN
SKU: 149712480
Availability: InStock

Huaswin Electronics Company

ISO9001 PTH BGA PCB Board Assembly / High TG PCB 2 Layer 4 Layer thumbnail-1

ISO9001 PTH BGA PCB Board Assembly / High TG PCB 2 Layer 4 Layer photo-1

Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)

Key Specifications

Get Latest Price

Brand Name:

HUASWIN

Place of Origin:

China

Model Number:

HSPCBA1019

Contact Supplier Request Quote Chat Now

Payment & Shipping

Payment Methods:

Port of Shipment:

China

Delivery Detail:

7 days

Product Details
Company Profile
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Brand Name HUASWIN

Place of Origin China

Model Number HSPCBA1019

Delivery Time:15-20 working days
Certification:ISO/UL/RoHS

ISO9001 PTH BGA PCB Board Assembly / High TG PCB 2 Layer 4 Layer

Quick Detail:

OEM/ODM/EMS services for PCBA PCBA, PCB assembly: SMT, PTH and BGA PCBA and enclosure design Quick prototyping Plastic injection molding Metal sheet stamping Final assembly Test: AOI, in-circuit test (ICT), functional test (FCT)

Detailed Specification of PCB Manufacturing

1	layer	1-30 layer
2	Material	CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
3	Board thickness	0.2mm-6mm
4	Max.finished board size	800*508mm
5	Min.drilled hole size	0.25mm
6	min.line width	0.075mm(3mil)
7	min.line spacing	0.075mm(3mil)
8	Surface finish	HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
9	Copper thickness	0.5-4.0oz
10	Solder mask color	green/black/white/red/blue/yellow
11	Inner packing	Vacuum packing,Plastic bag
12	Outer packing	standard carton packing
13	Hole tolerance	PTH:±0.076,NTPH:±0.05
14	Certificate	UL,ISO9001,ISO14001,ROHS,TS16949
15	Profiling punching	Routing,V-CUT,Beveling

Detailed Specification of Pcb Assembly

1	Type of Assembly	SMT and Thru-hole
2	Solder Type	Water Soluble Solder Paste,Leaded and Lead-Free
3	Components	Passives Down to 0201 Size
BGA and VFBGA
Leadless Chip Carries/CSP
Double-Sided SMT Assembly
Fine Pitch to 08 Mils
BGA Repair and Reball
Part Removal and Replacement-Same Day Service
3	Bare Board Size	Smallest:0.25x0.25 Inches
Largest:20x20 Inches
4	File Formats	Bill of Materials
Gerber Files
Pick-N-Place File(XYRS)
5	Type of Service	Turn-Key,Partial Turn-Key or Consignment
6	Component Packaging	Cut Tape
Tube
Reels
Loose Parts
7	Turn Time	15 to 20 days
8	Testing	AOI inspection
X-Ray inspection
In-Circuit testing
Functional test