Certification:UL, ISO9001, TS16949
1 OZ Immersion Gold 4 Layer Multilayer PCB For Splitters And Combiners
Specification:
|
Material |
FR4 TG135 |
|
Layer count |
4 layers |
|
Board thickness |
1.6mm |
|
Copper thickness |
1oz |
|
Minimum drill size |
0.2mm |
|
Minimum trace & gap |
0.1mm |
|
Surface finish |
Immersion gold |
|
Applications |
Splitters and combiners |
|
Special Technology |
NO |
PCB Circuit Board
|
NO |
ITEM |
Technical capabilities |
|
1 |
Layers |
1-20 layers |
|
2 |
Max. Board size |
508×610 mm |
|
3 |
Min. board Thickness |
2-layer 0.12mm |
|
4-layer 0.4mm |
||
|
6-layer 0.6mm |
||
|
8-layer 0.90mm |
||
|
10-layer 1mm |
||
|
4 |
Min. line Width/Space |
0.127mm(4mil) |
|
5 |
Max. Copper thickness |
5OZ |
|
6 |
Min. S/M Pitch |
0.075mm(3mil) |
|
7 |
Min. hole size |
0.15mm(6mil) |
|
8 |
Hole dia. Tolerance (PTH) |
±0.05mm(2mil) |
|
9 |
Hole dia. Tolerance (NPTH) |
Send Inquiry to This Supplier* Email
Want the best price?
Post an RFQ now!
Business Type
Trading Company
Total Employees
101 - 200 People
Main Markets
North America, South America, Eastern Europe
Location
Shaoxing, Zhejiang, China
You May Also Like
Recommended CategoriesExplore top categories and find suppliers for your specific needs
Viasion Technology Company.
AIBot OnlineThis conversation is AI-generated. Contact manufacturer before transaction to confirm info.
Your message has exceeded the limit.
|