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1 OZ Immersion Gold 4 Layer Multilayer PCB For Splitters And Combiners

1 OZ Immersion Gold 4 Layer Multilayer PCB For Splitters And Combiners photo-1
Negotiable MOQ: 1 set (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
VIASION
Place of Origin:
China
Model Number:
VM124
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
7 days
Brand Name VIASION
Place of Origin China
Model Number VM124
Delivery Time:2 weeks
Certification:UL, ISO9001, TS16949

1 OZ Immersion Gold 4 Layer Multilayer PCB For Splitters And Combiners

Specification:

Material

FR4 TG135

Layer count

4 layers

Board thickness

1.6mm

Copper thickness

1oz

Minimum drill size

0.2mm

Minimum trace & gap 

0.1mm

Surface finish 

Immersion gold 

Applications

Splitters and combiners

Special Technology

NO

PCB Circuit Board

NO

ITEM

Technical capabilities

1

Layers

1-20 layers

2

Max. Board size

508×610 mm

3

Min. board Thickness

2-layer 0.12mm

4-layer 0.4mm

6-layer 0.6mm

8-layer 0.90mm

10-layer 1mm

4

Min. line Width/Space

0.127mm(4mil)

5

Max. Copper thickness

5OZ

6

Min. S/M Pitch

0.075mm(3mil)

7

Min. hole size

0.15mm(6mil)

8

Hole dia. Tolerance (PTH)

±0.05mm(2mil)

9

Hole dia. Tolerance (NPTH)

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Business Type
Trading Company
Total Employees
101 - 200 People
Main Markets
North America, South America, Eastern Europe
Location
Shaoxing, Zhejiang, China
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