300 Watt High Power Led High Bay Light with UL CUL DLC SAA CE Approval , AC 200 - 480V

Delivery Time:3-5 days
Certification:UL,DLC,CULCE,ROHS,FCC

300 Watt High Power Led High Bay Light with UL CUL DLC SAA CE Approval , AC 200 - 480V

Quick Detail:

Type: Led high bay lights Lamp Power (W): 300 Input Voltage (V): AC100~277V 50/60Hz Place of Origin: Guangdong China Lamp: CREE XLMB Package Size: 330x330x450mm

Product description:

CREE Second Generation XMLB LED, high luminous efficiency and long life. MEAN WELL High efficiency LED Driver, the wide range input voltage AC200-480V； Heat pipe with fins cooling design, better cooling, light quality, LED Tj < 85℃. Excellent lampshade design, greatly improve the light utilization and evenness.

Applications:

UL LED High Bay Lighting series can be widely used in outdoor, indoor or outdoor lighting(Wet location), like mechanical or electronic processing workshops, storage warehouses, steel mills, gas stations, toll booth, waiting rooms, the platforms of railway station , indoor stadiums and flower cultivating tents etc.

Specifications:

Type	UL-HB30W27-xxK                            UL-HB30W48-xxK
Power	300W	Lighting Angle	45°/80°/120°
Input Voltage	AC200-480V	LED Brightness Decay	<5%/6000 hrs
PF	>0.95	Working Life	>50000 hrs
Driver Efficiency	>90%	Working Temperature	-30 - +40℃
Luminous Flux	28500 Lm	Storage Temperature	-40 -+80℃
Color Temperature	3000K/4000k/5000K/6500k	Protection Level	Wet Location/IP65
CRI	Ra>75	Cable	3 core,18AWG(1.5m)

Structure Features

Shell materials: Heat pipe and cooling fins for 1070 aluminum alloy. Color: Silver white (Electrolytic shading) Net weight: 11.50Kg Unit: mm

Irradiation Area (80°Lens)

Installation instruction:

Product Certifications:

Competitive Advantages:

1, BASED ON CREES SC3 TECHNOLOGY PLANFORM

Using XMLB LED of CREE Inc,Based on Cree’s SC3 technology platform,High efficiency and high reliability.

2, TESTING BY X-RAY

LED soft soldering testing by X-RAY for cold solder joint and soldering related non-conforming.

3,COPPER SUBSTRATE

Heat conductivity coefficient of copper substrate is 383.8W/m.K,but the traditional aluminum substrate is about 2.0-3.0W/m.K.

4,USING DLC TECHNOLOGY FOR MPCB

Using DLC technology for MPCB module,heat conduction rate at 200W/m.K,lower junction temperature.

5,USING METAL POWDER ADHESIVE

Using high conduction adhesives 30W/m.K,not the heat conductive silicone grease,it’s metal powder adhesive.

6,USING HEAT PIPE AND COOLING FINS FOR 1070 ALUMINUM ALLOY

Using heat pipe and cooling fins for 1070 aluminum alloy,fast conduction.

7,24 HOURS HIGH TEMPERATURE TESTING

High temperature testing room at 106℉,24 hours aging after aging.

30 minutes switch aging(10 seconds per cycle)

Factory Tour:

Certification: