Prototype HDI FR4 4 Layer PCB Green ENIG BGA Soldering For Mobile industry 100 300u

PRODUCT’S DETAILS

Raw Material

FR-4 (Tg 180 available)

Layer Count

4-Layer

Board Thickness

1.6mm

Copper Thickness

1.0oz

Surface Finish

ENIG

Solder Mask

Green

Silkscreen

White

Min. Trace Width/Spacing

0.075/0.075mm

Min. Hole Size

0.25mm

Hole Wall Copper Thickness

≥20μm

Measurement

300×400mm

Packaging

Inner: Vacuum-packed in soft plastic bales 
Outer: Cardboard Cartons with double straps

Application

Communication,automobile,cell,computer,medical

Advantage

Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug, 
BGA Soldering And Gold Finger Are Acceptable

Certification

UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB

 
PROCESS Engineer

ITEMS Item

         
 PRODUCTION CAPABILITY Manufacturing Capability

Laminate

Type

FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ,
ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON

Thickness

0.2～3.2mm

Production Type

    Layer Count

2L-16L

Surface Treatment

 HAL,Gold Plating,Immersion Gold,OSP,
Immersion Silver,Immersion Tin,Lead Free HAL

 Cut Lamination

Max. Working Panel size

 1000×1200mm

 Inner Layer

 Internal Core Thickness

0.1～2.0mm

 Internal width/spacing

Min: 4/4mil

 Internal Copper Thickness

1.0~3.0oz

 Dimension

Board Thickness Tolerance

±10%

 Interlayer Alignment

±3mil

Drilling

 Manufacture Panel Size

Max: 650×560mm

 Drilling Diameter

≧0.25mm

 Hole Diameter Tolerance

±0.05mm

 Hole Position Tolerance

±0.076mm

 Min.Annular Ring 

0.05mm

PTH+Panel Plating

 Hole W