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Polycrystalline Silicon Wafer for Solar Cell.
Negotiable
MOQ: 100000 Sets (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
HT
Place of Origin:
China
Model Number:
HT 156*156mm polycrystalline silicon wafer.
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
7 days
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Brand Name
HT
Place of Origin
China
Model Number
HT 156*156mm polycrystalline silicon wafer.
1. Introduction.
The poly wafers of Tangshan Haitai New Energy Technology Co., Ltd use the advanced facilities from America Switzerland, Hungary. Through continuous research and production practice, by using the vertical gradient solidification techniques and multi-line network cutting processes, HaiTai developed the fast crystal growth rate and unique annealing processes, effectively ensuring the stability of poly wafers and greatly improving the efficiency of the solar cell.
Poly wafer is the key materil of making solar cell,which is widely used in photovoltaic power generation, telecommunication ,transportation and residents in remote areas and also for solar lamp, lawn lamp and roof solar photovoltaic power generation .
The poly wafers of Tangshan Haitai New Energy Technology Co., Ltd use the advanced facilities from America Switzerland, Hungary. Through continuous research and production practice, by using the vertical gradient solidification techniques and multi-line network cutting processes, HaiTai developed the fast crystal growth rate and unique annealing processes, effectively ensuring the stability of poly wafers and greatly improving the efficiency of the solar cell.
Poly wafer is the key materil of making solar cell,which is widely used in photovoltaic power generation, telecommunication ,transportation and residents in remote areas and also for solar lamp, lawn lamp and roof solar photovoltaic power generation .
2. Specifications:
Growth Method:DSS.
Conductive Type: P.
Dopant : B.
Resistivity(ρ): 1.0 -3.0Ω•cm.
Minority Carrier Lifetime : ≥1.2μs.(Brick).
Oxygen Content(OI) : ≤1.0*10^18 at/cm3.
Carbon Content(C) : ≤1.0*10^17 at/cm3.
Size : 156*156±0.5mm.
Edge Angle: 45°± 10°.
Bebel Edge Width: 0.5-2mm.
Thickness: 200±20 μm.
TTV: ≤30μm.
Saw Mark: ≤15μm.
Bow/Warp: ≤50μm.
Chip: Depth ≤0.3mm, Length≤0.5mm.
Crack: Not allowed
Appearance: Visual inspection does not stain, gaps, holes and cracks.
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Business Type
Trading Company
Year Established
2008
Total Employees
101 - 200 People
Main Markets
North America, South America, Eastern Europe
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