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Home > Electrical & Electronics > Passive Components > Capacitor > Immersion Gold FR4 PCB Custom PCB Boards for Bluetooth Board, Computer Application

Immersion Gold FR4 PCB Custom PCB Boards for Bluetooth Board, Computer Application

Name: Immersion Gold FR4 PCB Custom PCB Boards for Bluetooth Board, Computer Application
Brand: Xinsheng
SKU: 147914102
Availability: InStock

Shenzhen Xinsheng Technology Co.,Ltd

Immersion Gold FR4 PCB Custom PCB Boards for Bluetooth Board, Computer Application thumbnail-1

Immersion Gold FR4 PCB Custom PCB Boards for Bluetooth Board, Computer Application photo-1

Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)

Key Specifications

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Brand Name:

Xinsheng

Place of Origin:

China

Model Number:

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Payment & Shipping

Payment Methods:

Port of Shipment:

China

Delivery Detail:

7 days

Product Details
Company Profile
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Brand Name Xinsheng

Place of Origin China

Delivery Time:5-25days
Certification:CE、ROHS、 FCC,UL ,SGS

Immersion Gold FR4 PCB Custom PCB Boards for Bluetooth Board, computer application

Description
1.Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

1.PCB factory directly
2.PCB Have the comprehensive quality control system
3.PCB good price
4.PCB quick turn delivery time from 48hours.
5.PCB certification(ISO/UL E354810/RoHS)
7.PCB is no MOQ/MOV.
8.PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

	High precision prototype	PCB bulk production
Max Layers	1-28 layers	1-14 layers
MIN Line width(mil)	3mil	4mil
MIN Line space(mil)	3mil	4mil
Min via (mechanical drilling)	Board thickness≤1.2mm	0.15mm	0.2mm
Board thickness≤2.5mm	0.2mm	0.3mm
Board thickness＞2.5mm	Aspect Ration≤13:1	Aspect Ration≤13:1
Aspect Ration	Aspect Ration≤13:1	Aspect Ration≤13:1
Board thickness	MAX	8mm	7mm
MIN	2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm	2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm
MAX Board size	610*1200mm	610*1200mm
Max copper thickness	0.5-6oz	0.5-6oz
Immersion Gold/ Gold Plated Thickness	Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u”
Hole copper thick	25um 1mil	25um 1mil
Tolerance	Board thickness	Board thickness≤1.0mm:0.1mm 1.0mm<Board thickness≤2.0mm:10% Board thickness>2.0mm:8%	Board thickness≤1.0mm:0.1mm 1.0mm<Board thickness≤2.0mm:10% Board thickness>2.0mm:8%
Outline Tolerance	≤100mm:0.1mm 100< ≤300mm:0.15mm >300mm:0.2mm	≤100mm:0.13mm 100< ≤300mm:0.15mm >300mm:0.2mm
Impedance	±10%	±10%
MIN Solder mask bridge	0.08mm	0.10mm
Plugging Vias capability	0.25mm--0.60mm	0.70mm--1.00