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Help CenterImmersion Tin HAL / ENIG Electrical Test Npth 1 - 16 Layers Tg Pcb With Electrical Test
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Immersion Tin HAL / ENIG Electrical Test Npth 1 - 16 Layers Tg Pcb With Electrical Test
Description:
|
Layer |
1-16 |
|
Material |
FR4 |
|
Thickness |
0.2-3.2mm |
|
Surface finishing |
HAL/ENIG |
|
Copper |
0.5-3oz |
|
Test |
Electrical Test |
The glass transition temperature (Tg) is an important normative dimension for the base material that determines the temperature at which the resin matrix converts from a glassy, brittle condition into a soft, elastic one.
The Tg value of the base material sets here an upper boundary, at which the resin matrix decomposes and a subsequent delamination occurs. The Tg is thus not the value of the maximum operational temperature, but rather that which the material can endure for only a very short time. A guideline for a continuous thermal load is an operating temperature approximately 25°C below the Tg.
When the glass transition temperature (Tg) is over 170°C, it is referred to as a high Tg material. We also call it TG170 board.
High Tg materials have the following properties:
· high glass flow temperature value (Tg)
· high temperature durability
· long delamination durability
· Low Z axis expansion (CTE)
Applications:
Printed circuit board can be used for all kinds of electrical products, such as computer, radio, TV, mobile, mp4, led and so on. It’s widely used in various of industries in the world. We have been pcb/pcba business for ten years and provide different customized pcb to many countries all over the world. Welcome to contact us for further news.
Specifications:
|
Product Technical Parameter |
|||
|
Basic technology |
Parameter |
||
|
Single/Double sided |
Multilayer |
||
|
Number of Layers |
1-2 |
4~16 |
|
|
Copper Thickness |
0.25~3.0OZ |
0.5~3.0OZ |
|
|
Base Board Thickness |
0.2~3.2mm |
0.6~3.2mm |
|
|
Incombustibility |
94V-0 |
94V-0 |
|
|
Peelable resistance |
12.3N/cm |
12.3N/cm |
|
|
Twist |
≤0.5% |
≤0.5% |
|
|
Insulation resistance |
≥1011Ω |
≥1011Ω |
|
|
Test voltage |
10-300V |
10-300V |
|
|
Finished board area |
560×970mm |
560×970mm |
|
|
Min. Line Width and Spacing |
0.1/0.1mm |
0.1/0.1mm |
|
|
Copper thickness in hole |
≥25.0um |
≥25.0um |
|
|
Mini. pad diameter |
Inner layer |
0.05mm |
|
|
Out layer |
0.076mm |
0.076mm |
|
|
Mini. Hole Diameter |
0.25mm |
0.20mm |
|
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