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DEUTEQ PALLAK 934
Decorative Palladium Plating
Introduction
1. A neutral palladium plating process, which can produce 99.9% pure palladium deposit, up to 1um thickness.
2. Suitable to plate on nickel, brass or silver.
3. The deposit is suitable for jewelry, watchcase, stationery, glasses frame and other decorative plating application.
4. Used both for rack plating or barrel plating, manual or full automatic line.
Operating Conditions
Palladium content g/L 2.0
Plating speed mg/A min 16
Time for 0.2um deposit
Rack plating (1.0A/dm2)/ min 2.75
Barrel plating (0.3A/dm2)/ min 8.25
Cathode current density
Rack A/dm2 1.0
Barrel A/dm2 0.3
pH value 7.0
Specific gravity°Bé 9
Temperature °C 50
Anode/Cathode 2:1 or above
Agitation Mild mechanical stir ( No air agitation)
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