4/3.5mil 1.6m Immersion Gold FR4 Rigid Printed Circuit 8 Layer PCB Board Assembly

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

1~8(Rigid-Flex & Multilayers  FPC)

1~2

Single Sided

0.050 mm

Double Sided

0.075 mm

Drilling P.T.H.

0.2 mm

Punching

1.0 mm

Conductor Width (W)

0.025 mm

W0.5mm

Hole Diameter (H)

0.05 mm (withP.T.H.0.1mm)

H1.5mm

Accumulated Pitch (P)

0.05 mm (Special0.03mm)

P25mm

Outline Dimension (L)

0.05 mm

L50 mm

Conductors and Outline (C)

0.15 mm (Special 0.07mm)

C5.0 mm

Conductors and Coverlay

0.3~0.5 mm 

Surface Treatment on

Soft or Hard Ni/Au Sn/Pb (2~60μm)

Primary FluxCarbon Printed

4~10μm Silver Gel printed

Terminals and land Areas

Insulation Resistance

1000MW

IPC-TM-650  2.6.3.2 

at Ambient

Dielectric Strength

5KV

IPC-TM-650  2.5.6.1

Surface Resistance (W)

5x012

2x015

IPC-TM-650  2.5.17

Volume Resistivity (W-cm)

1x015

1x015

IPC-TM-650  2.5.17

Dielectric Constant (1 MHz)

4

3.4

IPC-TM-650  2.5.5.3

Dissipation Factor (1 MHz)

0.04

0.02

IPC-TM-650  2.5.5.3

Peeling Strength (180 irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650  2.4.9

Solder Heat Resistance

260 .C/10secs