Lead free BGA Solder Paste for BGA reball kit repair

Lead free BGA Solder Paste for BGA reball kit repair 

Chracteristics:

1. Excellent stability,resolving power for continuous printing; good viscosity
2. Without causing slumping, bridging or splashing of tin ball

3.Alloy components :Sn96.5/Ag3/Cu0.5

Application:
Apply to fine spacing solder paste printing and back to welding, suitable for welding, high nitrogen back preheated back welding, gold-plated,
Silver, nickel plating, spray tin, nude copper printed circuit board and so on many kinds

More products please login below company websites:

MINGDA Technology Co.,Ltd

Ms .Doris zhang sales manager

Tel:0086-0755- 83360136    

0086-0755-13500068891

Fax:0086-0755-82736291  

Skyp:  mdanti-static

MSN :  md-99@163.com  

Email:  md-99@163.com

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