Ceramic Substrate Printed Board

Items

Capability

Month Capability

4000type/month,5000Sqm/month

Board Materials

Normal Materials: ShengYi, ITEQ,KB

SpecialMatrials:Rogers, Arlon,Taconic,Nelco, Isola

High TG: S100-2,IT180

Finished Surface

OSP(Entek),HAL,Leadfree HASL,ENIG,

Immersion Tin,Immersion Sliver,Hard Gold,

Hard Gold,Platting Gold,Gold Finger,Enepig

Thickness Tolerance

Thickness≤1.0mm:0.1mm

1.0mm<Thickness≤2.0mm:10%

Thickness>2.0mm:8%

PTH:3mil NPTH:2mil

Outline Tolerance:

Length≤100mm:0.1mm

100<Length≤300mm:0.15

Length>300mm:0.2mm

Technical Specification

Min Line Width/Gap:3.5/3.5 mil

Min Hole Size:0.15mm for mechanical drill

            0.1mm for Laser drill

Min Annular Ring:4 mil

Max copper thickness:12OZ

Max finished size≤2 layers 600*1200mm

Multi-layers:500*1200mm

Board thickness: 2 Layers: 0.2-7.0mm

           Multi-layers:0.4-7.0mm

Min Sold Mask Bridge≥0.08mm

Aspect Raion: 15: 1

Plugging Vias Capability:0.2-0.8mm

Au,NI Thcikness Control:

1.       ENIG:Au---1-10u〞

2.       Gold Finger: Au---1-150u〞

3.       Platting Gold:Au---1-3u〞

4.       Hard Gold: Au---1-150u〞

5.       Ni Thickness:50-500u〞

6.       Ni-Pd-Au: Pd---2-5u〞, Au---1-8u〞