ALL CATEGORIES

Seller Center
- Product Management
  
  Post Product
  
  Manage Products
  
  Featured Products
- Blog Management
  
  Post Blog Article
  
  Manage Blog Articles
  
  Manage Blog Categories
- Inquiry Management
  
  My Inquiries
  
  Buying Requests
- Analytics Center
  
  Performance Dashboard
  
  Product Analytics
  
  Visitor Analytics
Connect Your Store to WeChat

Follow Our Official Service Account
Manage Products & Inquiries Anywhere
Seller Services

Seller Services

Goldsupplier.com: 20 years of Global Trade Expertise, Empowering Your Business to Go Global!

Join GoldSupplier.com

Free & Instant Registration

Showcase Company & Products

Access Global Buying Requests

Register Now

Activate Verified Supplier Membership

Priority Verified Visibility

Claim Exclusive Buying Requests

Automated Multi-language Store

Verified Now

Launch Your EasyOcean Website

Full-Service Website Management

Google Page 1 Guarantee

Enhanced Brand Credibility

Launch Now
Buyer Services
Post Buying Request

Browse Product Categories

Featured Suppliers
Contact Platform Support

Help Center

Home > Electrical & Electronics > Integrated Circuit > General-purpose Integrated Circuit > Ceramic Substrate Printed Board

Ceramic Substrate Printed Board

Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)

Key Specifications

Get Latest Price

Brand Name:

Place of Origin:

China

Model Number:

YW006

Contact Supplier Request Quote Chat Now

Shenzhen Yuwei Electronic Co.,Ltd

Payment & Shipping

Payment Methods:

Port of Shipment:

China

Delivery Detail:

7 days

Product Details
Company Profile
Contact Us

Brand Name YW

Place of Origin China

Model Number YW006

Ceramic substrate printed board

Finish:IMMERSION TIN
layers count:2
thickness:20.32mil
material:Rogers
min line width/sapce:5/16mil
min via holes:15.24mil

Items	Capability
Month Capability	4000type/month,5000Sqm/month
Board Materials	Normal Materials: ShengYi, ITEQ,KB
	SpecialMatrials:Rogers, Arlon,Taconic,Nelco, Isola
	High TG: S100-2,IT180
Finished Surface	OSP(Entek),HAL,Leadfree HASL,ENIG, Immersion Tin,Immersion Sliver,Hard Gold, Hard Gold,Platting Gold,Gold Finger,Enepig
Thickness Tolerance	Thickness≤1.0mm:0.1mm 1.0mmThickness≤2.0mm:10% Thickness>2.0mm:8%
	PTH:3mil NPTH:2mil
	Outline Tolerance: Length≤100mm:0.1mm 100Length≤300mm:0.15 Length>300mm:0.2mm
Technical Specification	Min Line Width/Gap:3.5/3.5 mil
	Min Hole Size:0.15mm for mechanical drill 0.1mm for Laser drill
	Min Annular Ring:4 mil
	Max copper thickness:12OZ
	Max finished size≤2 layers 6001200mm Multi-layers:5001200mm
	Board thickness: 2 Layers: 0.2-7.0mm Multi-layers:0.4-7.0mm
	Min Sold Mask Bridge≥0.08mm
	Aspect Raion: 15: 1
	Plugging Vias Capability:0.2-0.8mm
	Au,NI Thcikness Control: 1. ENIG:Au---1-10u〞 2. Gold Finger: Au---1-150u〞 3. Platting Gold:Au---1-3u〞 4. Hard Gold: Au---1-150u〞 5. Ni Thickness:50-500u〞 6. Ni-Pd-Au: Pd---2-5u〞, Au---1-8u〞