Ceramic Bond Diamond Grinding Wheel
Ceramic bond Diamond grinding wheel have characteristics of sharp cutting, high efficiency, long life, less heat and blocking generated, easy control the precision and easy dressing.
Application:
Ceramic bond diamond grinding wheels: Mainly used for machining tungsten carbide, ceramic, cermets, optics materials, PCD, PCBN, CVD, natural diamond, stones and so on.
Diameters: φ25—750mm
Thickness: 5-300mm
Grit: 60/70~W3.5
Concentration: 25, 50, 75, 100, 125, 150
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