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PUR Hot Melt Adhesive for Laptop

PUR Hot Melt Adhesive for Laptop photo-1
US$ 1 - 3 MOQ: 300 Pieces
Key Specifications
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Brand Name:
WEILICHI
Place of Origin:
China
Model Number:
PUR6302
Payment & Shipping
Payment Methods:
Port of Shipment:
Shanghai
Delivery Detail:
15 days
Brand Name WEILICHI
Place of Origin China
Model Number PUR6302
Type hot melt adhesive
EINECS No. N/A
MF N/A
Other Names PUR adhesive for laptop
CAS No. N/A
Classification Hot Melt Adhesives
Usage Other, digital products
Main Raw Material Polyurethane


PUR hot melt adhesive for bonding of all kinds of plastic and metal substrate in electronics and micro electronics industry.Mainly for substrates of digital products such as mobile phone, tablet, mobile power pack, laptop, MP3 player, PCB etc. 


Advantages:


1. Good high temperature resistance, damp and heat resistance, chemical corrosion resistance


2. High peel strength


3. Good adhesion to variety of substrates.



Application:


1.PUR6302 for bonding of plastic substrate in electronics and micro electronics industry.


2.PUR6301 for bonding of all kinds of substrate in electronics and micro electronics industry .



Model Appearance Melting viscosity Open time Operation temperature Application
mPa.s second °C
PUR6302 white solid 8000±500/120°C 360 110~130 good adhesion to various of plastic materials, suitable for bonding of plastic substrate in electronics and micro electronics industrial.
PUR6301 white solid 6000±500/110°C 90 110~130 mainly used for bonding of all kinds of substrate in electronics and microelectronics, such as ABS, Makrolon, Fiber Reinforced Plastics, polyester, acrylic, gel coat, epoxy resin, PVC, aluminium alloy, stainless steel, copper, steel alloy etc.


Product Tags: PUR hotmelt adhesive for laptop , PUR hot melt glue for laptop , PU reactive hot melt adhesive for laptop

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Business Type
Trading Company
Year Established
2010
Factory Size
10,000-30,000 square meters
Annual Export Value
US$1.5 Million - US$2.5 Million