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SYJ-800 Diamond Saw Cutting/Dicing Machine

SYJ-800 Diamond Saw Cutting/Dicing Machine photo-1
SYJ-800 Diamond Saw Cutting/Dicing Machine photo-2
Negotiable MOQ: 1 Set (Price negotiable depending on order volume and customization)
Key Specifications
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Place of Origin:
Shandong, China
Brand Name:
WEIYI
Model Number:
SYJ-800
Payment & Shipping
Payment Methods:
Port of Shipment:
qingdao
Delivery Detail:
Delivery time depends on order quantity.
Place of Origin Shandong, China
Brand Name WEIYI
Model Number SYJ-800
Material Diamond
Blade Length diameter86*70/100*12.7mm
Dimensions 700*530*750mm
Weight 45KG

SYJ-800 diamond saw Cutting/Dicing machine

Detail
 
 

Model:

SYJ-800 Cutting/Dicing Saw

Brief Introduction:

 

SYJ-800 Cutting/Dicing Saw is mainly used for dicing and cutting all kinds of crystal, glass, ceramic, mineral, metal. It can realize the computer 3D automatic control. Dicing crystal wafer's diameter can reach to 200mm, cutting accuracy can reach to  0.02mm. It's one of the best precision cutting saw for lab and factory's manufacturing.

 

Main

Feature:

1. Single board computer and normal computer can be used to control this machine, allowing user to program,  manual cutting and dicing.

2. 0.5 hp high torque brushless DC motor, can reach to 0-3000 r/min,voltage: 110V-220V.
3. PC controlled stepping motor driving resolution 0.0025mm,position accuracy 0.01mm.
4. Manual control /  Automatic digital control by control box .Equip with exquisite sample spinning platform, can turn 360°, cutting angle tolerance  + /-0.5° .

5. Equip with precision φ200mm vacuum chuck, andφ200mm glass or ceramic resin sample holder.

6. Suited blade and blades clamp can be choice according to cutting materials' dimension.
7. Water-proof system and splashing protection
,throttle valve adjust the cutting liquid flow.

Technical

Parameter:

 

No.

Item

Technical Standard

Unit

1

Principal axis drive power

0.5

p

2

Principal axis rotating speed

0-3000

r/min

3

X-axis travel distance

205

mm

4

Y-axis travel distance

205

mm

5

Z-axis travel distance

70

mm

6

Processing wafer thk.

0.05-2.5

mm

7

Cutting max depth

10

mm

8

Operating platform turn angle and turn angle error

360±0.01

(°)

9

Stepping motor resolution

0.0025

mm

10

Stepping motor position accuracy

0.01

mm

11

Dia.Sample Holder

200

mm

12

Dia.Vacuum chuck

200(8inch)

mm

13

Blade outside diameter

Dicing blade 86,cutting blade 100

mm

14

Blade inside diameter

12.7

mm

15

Voltage

220

V

 

Specification:

700mm×530mm×750mm

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Business Type
Manufacturer, Trading Company
Year Established
2001
Factory Size
10,000-30,000 square meters
Total Employees
51 - 100 People