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6 Layer Rogers PCB High Frequency Board For Communication Products

6 Layer Rogers PCB High Frequency Board For Communication Products photo-1
6 Layer Rogers PCB High Frequency Board For Communication Products photo-2
Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
XCE
Place of Origin:
China
Model Number:
XCEM
Payment & Shipping
Payment Methods:
Port of Shipment:
Shenzhen/HongKong
Delivery Detail:
4 days
Brand Name XCE
Place of Origin China
Model Number XCEM
Surface Finishing Immersion Gold
Min. Line Spacing 4mil
Min. Line Width 4mil
Min. Hole Size 0.2mm
Board Thickness 0.79mm
Copper Thickness 1oz
Base Material Rogers

6 Layer Rogers High Frequency Board Use For communication products

 

 

 

Quick detail:

Origin:ChinaSpecial: High frequency pcb
Layer:6Thickness:0.79mm
Surface: ENIGHole:0.8

 

 

Specification:

High frequency pcb  high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

High frequency materials are UL 94V-0 rated for active devices and high power RF designs.

 

 

Typical Applications

  • Cellular Base Station Antennas and Power Amplifiers

  • Microwave point to point (P2P) links

  • Automotive Radar and Sensors

  • low dielectric loss

  • RF Identification (RFID) Tags

  • The stability of the dielectric constant

  • An extremely low water imbibition

  • LNB’s for Direct Broadcast Satellites

 

RO3200 series material RO3203 (r = 3.02) and RO3210 (r = 10.2) two composition, suitable for application RO3000 series material but need better mechanical strength of the occasion. RO3200 series material is a combination of PTFE / ceramic with PTFE / woven fiberglass laminated, with good rigidity and RO3000 materials, the material in this series can also be produced with mixed FR4 multilayer MLB

 

 

Parameter:

 

oItemData
1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size: (580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance: ±0.13
13Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling

 

 

Features

 

 

• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program

 

 

Rogers material in stock:

 

BrandModelThickness(mm)DK(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO40030.254 0.508,0.813,1.5243.38
RO43500.254 0.508,0.762,1.5243.5
RO58800.254.0.508.0.7622.2
RO30030.127,0.508,0.762,1.5243
RO30100.63510.2
RO32060.635MM10.2
R030350.508MM3.5
RO60100.635MM, 1,27MM10.2

 




Karen-Sales Department

Xinchenger Electronics(HK) CO.,Ltd

sales3@xcepcb.com

Skype:karen-xcepcb



Product Tags: Rogers PCB , Communication Products , High frequency PCB

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Business Type
Manufacturer
Year Established
2002
Annual Export Value
US$10 Million - US$50 Million
Port of Shipment
ShenZhen, HongKong

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