Low Temperature Co-fired Ceramic LTCC

Specifications

LTCC Manufacture Process

     LTCC is the technology which uses ceramic as the material for green sheet manufacturing. By mixing ceramic powder into organic binder, the pulp could be cut into green sheets by scrapers after dried up. Then, punch holes and print circuit on the sheet. Silver and gold are commonly used in making the electrodes. Applied with blade coating method in parallel printing, the blended ceramic components are shaped after sintered in furnace under 850 ~ 900°C.

     Since ceramic has the similar properties which silicon possesses, it shows great advantage while applied to IC wafer products. What’s more, ceramic dielectric material endows LTCC with stable dielectric constant, and substrates can be stacked to more than 10 layers.

      As a matter of fact, LTCC enjoys a variety of excellent properties such as good thermal conductivity, high insulation and high temperature resistance.

     It’s worth mentioning that the line width distance of circuit which is made by LTCC could be as small as 50 μm. Due to the tiny volume that LTCC gains, it is widely used as indispensable component in making high-frequency module, LED module, ceramic antenna, and filter ect.

    Accordingly, a boost of market could be easily seen in those areas of mobile communication products, notebook manufacturing, communication equipments. For instance, Bluetooth, WLAN, Wi-Max, Wi-Fi, GPS, and CDMA, ect