Auto BGA Rework Station With Surveillance Camera SV550 for Iphone Bga Replacement
Auto BGA Rework Station with Surveillance Camera
Specification
Applicable PCB: |
W20*D20~W540*D450mm |
PCB thickness: |
0.5~4mm |
Working table adjustment: |
±120mm forward/backward, ±80mm left/right |
Temperature control: |
K-type thermocouple, close cycle controlled |
Upper heater(hot air): |
1200W |
Lower heater(hot air): |
800W |
Bottom IR heater: |
3600W |
Power supply: |
AC singal-phase 220V 50/60Hz |
Applicable BGA: |
1*1~80*80mm |
Placement precision: |
0.05mm |
Max BGA weight: |
80g |
Machine Weight: |
75KG |
Machine Dimension: |
L750*W820*H800mm |
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Features
- Three heating systems( upper/lower hot air heater, bottom IR heater) heating independently, time and temperature can be displayed digitally on touch screen;
- Optical vision system can move along with X,Y axis automatically; easy for placement and operation;
- Large movable bottom IR heating area, PCB clamps can be adjusted along with X & Y table flexibly, the max PCB size it can handle up to 550×500mm;
- Powerful cross flow fans cool the bottom heating area rapidly with stable speed.
- Color optical system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration detection device; with auto focus and software operation function, 27 X optical focus, able to rework BGA sized up to 70×70mm;
- Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display set profile and 5 practically tested profile at the same time; can analyze the five practically-tested profiles, and compare them with the history saved profiles;with USB for connecting mouse and updating software;
- Color LCD monitor; big size screen, easy to operate;
- Built-in vacuum pump; the max suction up to 80g; 60 °rotation in φ angle,
- 8 segments of temperature up(down) and 8 segments constant temperature control, profile saving is unlimited in the industrial computer;
- Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range;
- Auto pick up chip, auto solder, auto remove, auto placement;
- Alloy nozzle assures the durability and stability in reflow, able to locate in any angle;
- Visible monitoring system, can view the melting procee of the balls,(optional).
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