Saw Damage Etching and Texturing
Specifications
1.Removal of the surface damage2.advanced PID temp. control system, Getting Homogeneously textured surface
3.Stable,
Application:
Removal of the surface damage induced by the sawing process. Improvement of the light trapping by the generation of a textured surface.
Features and Benefits
- Using advanced PID temp. control system, Getting Homogeneously textured surface
- Processing of multicrystalline and monocrystalline wafers
- Stable, reproducible process results
- Using auto-dosing system
- Optimised operating costs
Technical Data
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Standard Outline dimension:
8600*2000*2200 (length*width*heigh) - Throughput:
2100 for 125mm wafers/h gross, 1800 for 156mm wafers/h gross - Thickness: >150um
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