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Full-automatic H80 3D Solder Paste Thickness Tester With PCB Mark SMT Equipment

Full-automatic H80 3D Solder Paste Thickness Tester With PCB Mark SMT Equipment photo-1
Negotiable MOQ: 1 Set (Price negotiable depending on order volume and customization)
Key Specifications
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Place of Origin:
Guangdong, China
Brand Name:
Wisdomshow
Power:
Other, Electronic, Single-phase AC 220V, 60/50Hz
Payment & Shipping
Payment Methods:
Port of Shipment:
FOB Shenzhen and FOB HongKong
Delivery Detail:
Delivery time depends on order quantity.
Place of Origin Guangdong, China
Brand Name Wisdomshow
Power Other, Electronic, Single-phase AC 220V, 60/50Hz
Usage Auto Testing Machine

Specifications

H80 3D Solder Paste Thickness Tester
1 Max measuring range530mm *460mm
2 Automatic plywood, quickly position
3 SMT Equipment

                         H80 3D Solder Paste Thickness Tester

Features

1. the maximum measuring range,330mm*300mm (530mm *460mm), fully meet the requirements of the substrate;

2. Automatic plywood, quick positioning, without manual adjustment, can be described as easier to operate, truly programmable test system;

3. looking through the PCB MARK automatically check and correct the offset position;

4. A 3-axis automatic movement, auto focus, automatic compensation correction substrate warpage, solders paste height to obtain accurate figures;

5. High-speed Japanese COOL MUSCLE integrated servo system, high speed, high precision and powerful SPC statistical analysis software;

6. can coordinate when the SMT machine use, early warning, can automatically generate CP, CPK, X-BAR, R-CHART, SIGMA column, Trends, control charts, etc.;

7. the scanned image can be sliced cross-section measurement and analysis, when using 2D solder paste thickness tester;

8. Precise and reliable hardware system to provide credible and reliable service life test accuracy;

9. The thicknesses of the test beyond the multi-function test solder paste;

10. A list of measurement data is automatically saved to generate SPC reports for easy viewing;

 

Others

  • IC package, PCB space deformation measurement;
  • steel mesh hole size and shape measurements;
  • PCB pad, screen thickness and shape of the measurement pattern;
  • to provide squeegee pressure prediction, the printing process optimization;
  • chip state Set, part of flatness, BGA / CSP size and shape measurement equipment;

 Technical Parameters

Tiptop measure precision(Z)

Height(Z),0.5µm

Repeat precision

Height, below 1.2µm    Volume ,below 1%   

 Zoom multiple

 50X

Optics inspection system 

Germany CCD camera

Laser system

Laser  module with glowing

Auto-system

Full  automaticity

Measure principle

Non-touch laser bean

Scan area (X/Y)

330mm(X)* 300mm(Y)
530mm(X) *460mm(Y)

Max measure height

5mm

Measure speed

Max-150 Profiles / sec

 SPC soft

Cp, Cpk, Sigma, Histogram Chat, X bar R&S, Trend, Scatter, Pdata report to Excel & Text

PC system 

LCD Windows XP

Language

Simplified Chinese , Traditional Chinese, English

 Power

Single-phase AC 220V, 60/50Hz

 Weight

 75kg

Product shape size

668(W) x 775(D) *374(H) mm

Packing size

 790(W)×880(D) *630(H) mm

Other SMT Accessary Equipments

Adjustable BGA Reball Kit

Constant Temperature Preheater WDS-220

Optical Plate Cutting Machine

Temperature Curve Tester For Oven

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Business Type
Manufacturer
Year Established
2011
Factory Size
Below 1,000 square meters
Total Employees
51 - 100 People

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