Only Us New Tech WDS-700 Auto BGA Rework Station Mobile IC Removal Machine

Full Specification of WDS-700 Mobile IC Removal Machine 

***Independent 2 heating zones temperature control system 

1.The upper and lower heating zone,temperature precision control within ±1℃. which can heat up at the same time from the top of he component to the bottom of the PCB; 8 segment temperature control le repairing tool kit

2.Hot air district heating for BGA and PCB at the same time,the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.

3.Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system;

4 temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved;temperature can be tested precisely through external measurement interface,curves can be analysed,set and correct on the touch screen at any le repairing tool kit

***Precision optical alignment system

Using high definition and adjustable CCD color optical alignment system,beam split,amplification,lessening,fine adjustment and auto focus with the function that automatic color aberration resolution and brightness adjustment,adjustable image contrast;equipped with 15 ” high definition LCD monitor. Optical motherboard bga rework station

***Multi-functional and humanized operation system

1.Adopting the HD touch human-machine interface;upper heating head and mounting head designed 2 in 1;providing many kinds of titanium alloy BGA tuyere can be rotated in 360 degree for easy installation and replacement.

2.X,Y and R angle adopted micrometer fine-tuning,accuracy locating,precision can reach ±0.01mm.

***Superior safety protection function

With alarm function, after the BGA welding the machine can alarm by itself.
In the case of temperature abuse, the circuit can power off automatically with the double over-temperature protection.Temperature parameter having password protection to prevent any le repairing tool kit