plated gold mobile phone motherboard and keypads pcb

Category

Description

Capability

File Formats

Gerber files- preferred

274-X,274-D,DPF,ODB++

Drill file

X & Y coordinates, with tool sizes included

Laminate Materials

CEM1, CEM3, FR1, FR4(High TG, halogen-free), ISOLA(FR408,370HR), TEFLON, POLYIMIDE, ROGERS(RO4003,RO4350,RO4450),Aluminum plate (Single, Double-sided)

Layer count

Layer count

1-26 layer

Board dimensions

Max. finished board dimensions

39.37"x23.6" (1000mm*600mm)

Tolerance of finished board dimensions

±0.15mm

Board Thickness

Finished board thickness

0.2-4.0mm

Tolerance of finished board thickness

Thickness <1.0mm:                  ±12%

1.0mm ≤ Thickness <2.0mm:        ±8%; ±10%

Thickness ≥2.0mm:                  ±10%

Warp and twist

≤0.5%

Copper

Outer Cu thickness

0.5oz ~ 7oz

Inner Cu thickness

0.5oz ~ 5oz

PTH hole copper thickness

0.4-2mil (10-50um)

Drilling

Min.  diamension of drilled hole

3mil (0.075mm)

Min. drilling diameter

1.5mm 

Drill Deviation

±0.002” (0.050mm)

PTH hole tolerance

±0.003” (0.075mm)

NPTH hole tolerance

±0.002” (0.050mm)

Min. half hole dimension

0.6mm

Tolerance of drilled slot

±3mil (±75um)

Plating

Max aspect ratio of PTH

10:01

Max. solder mask plug hole diameter

0.8mm

Max gold thickness of gold finger

60u" (1.5um)

Max nickel thickness of gold finger

280u" (7um)

Etching

Trace width tolerance

±20%

Min. trace width / space (1oz finished Cu thickness starting from 1/3oz)

0.003”/ 0.003”(0.08mm)

Min. trace width / space  (1oz finished Cu thickness starting from 1/2oz)

0.004”/ 0.004”(0.1mm)

Min. trace width / space (2oz finished Cu thickness)

0.005”/ 0.005”(0.127mm)

Min. trace width / space  (3oz finished Cu thickness)

0.008”/ 0.008”(0.2mm)

Min. trace width / space (4oz finished Cu thickness)

0.012”/ 0.012” (0.3mm)

Inner Layers

Min. space from drilling to inner pattern

0.1mm

Min. space from annular ring to inner pattern

0.1mm

Layer-to-layer registration

±3mil(76um)

Solder Mask

Color

green, white, black, yellow, red, blue 

Min. solder mask clearance

0.003”

Thickness

0.0004”

Silkscreen

Color

White, black, yellow, red, blue, green

Electrical Test

AOI 

Y

Flying Probe Tester

Y

Controlled Impedance

Tolerance

±10%

Impedance tester

Tektronix TDS8200

Routing

End Mills Test

±0.15mm(0.006”)

CNC Tolerance

±0.15mm(0.006”)

V-Cut Depth

±0.1mm(0.004”)

V-cut angle deviation

±0.1mm(0.004”)

Semi-hole

Y

Surface Finish

HASL,HASL lead free, immersion gold, immersion silver, immersion tin, O.S.P (Entek),plating gold, carbon ink

Blind and Buried Vias

3+N+3

Y

Resin,hole-filling ink,PTH

Y

Others

UL Cert.

Y

ISO Cert.

ISO9001/ISO14001/RoHS