94v0 Mass Production Mobile Phone PCB Board

Layer Counts

1-16layers

Product Categories:

single/double sided board, multi-layer board, high density board, including MLB with blind/buried via holes

Main base material:

FR-1, FR-2, FR-4, CEM-1, CEM-3, High Frequency Laminate with various dielectric constant (imported or from local supplier), Aluminum base laminate, Metal core Aluminum

Surface Finish:

 lead free HASL, immersion gold/silver/tin, plating gold, OSP

Board Thickness:

Inner core thickness 0.15-1.5mm, finished board thickness 0.20-5.0mm

Copper Foil Thickness:

1/3 oz~6oz (18um – 210um)

Min. hole size: 

0.2mm/8mil

Min. line width: 

0.1mm/4mil

Min. spacing: 

0.1mm/4mil

Maximum Size: 

600mm x 10000mm

Min. Size: 

5mm x 10mm

Solder Mask Type: 

Liquid photo-imageable, Thermosetting solder, UV solder mask

Outline Tolerance:

±0.13mm(r0. ±0.13mm(routing), ±0.05mm(punching)

Inner Layer registration tolerance:

±0.05mm

Production capacity per month:

≥10000sqm

Profiling:

Punching, Routing, V-CUT, Beveling