Wafer Cutting Machine

Specifications

Wafer cutting machine
1. use to cut the wafer book
2. size would be adjusted
3. easy control

Wafer cutting machine

(1) Descriptions:

1. It is a blade or wire cut machine to cut the cream filled wafer sheets depending on the final size required.
2. The cutting size can be continently adjustable.
3. This machine is pneumatically handled so that the smooth transfer through the machine is ensured.
4. The direction changing to have longitudinal and cross will be done automatically.
5. The antiseptic treatment is made after the machine frame and racks made by carbon node steel, the table are polished carbon steel with chrome plating.

 

(2)Main Technical Parameter:

Material	Adopts 304 Stainless Steel, Germany SEW motor
Cutting method	Blade or Steel Wire type
Cutting capacity	25 pieces/min
Dimension	2400*2100*1000mm
Power	1.5KW
Electric Motor	380V, 0.75KW

 

(3) Superior after-sales service:

1. One year guarantee  

2. We will help the client solve the machine problem anytime the clients when there is something wrong with the machine in the future.

(4)Trade condition

Supply Capacity	15 sets/month
Minimum quantity order	1 set
Delivery Time	45 days
Loading Port	Guangdong Port
Payment Terms	L/C, T/T
Packing	iron and waterproof