High component PCB Depanelizer

Specifications

SM-2008B separates both small and large PCBs fast and economicaly. The max component height of the PCB edge is 70mm.

1, Features:

SM-2008 separates both small and large PCBs fast and economicaly. To optimize operation,the separation length can be programmed

Safe operation

The PCB is placed with its pre-scored groove onto the linear blade,when the foot swith is pressed,the blade carrier with the circular blade moves across the PCB,separating it into individual units.

The clearance between the upper guide and the linear blade is adjustable to ensure that the PCB is only separated in the pre-scored groove.

Recommended pre-scored grooves

The pre-scored grooves can be interrupted by any number of cutouts.

If components project above the groove,the linear blade needs to be cut out, in such a case,contact us.

Programmable cutting lengths ranging to 460mm, eliminating time-consuming unnecessary board travel. (Cut length of up to 600mm  also available)

Motorized circular blade cuts against the linear blade to ensure clean, burr-free processing without board stress.

Programmable to exact cutting length required.

Will depanel PCBs with components 1mm from the score line.

Quick-lock design for easy circular blade setup to any PCB thickness.

Hardened tooled steel long-life blades

Large processing table, which can be angled to permit processed boards to fall away.

For operator safety, there are blade-halting light sensors and a Plexiglas safety shield.

Four separating speeds available – adjustable by front rotary knob.

2, Specifications:

PCB panels

PCB thickess A:    0.8-3.2mm

The length of  linear blade: 450mm

Remaining PCB thickness B: Typical: 1/3 of Dim.A  Max: 0.8mm

Depth of scoring C: Min. 0.25mm

Increase in external dimensions after separation: 0.1-0.2mm

The max component height of the PCB edge: 70mm