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Repair Motherboard Chipset Machine DH-G200 For Chipset Reballing

Repair Motherboard Chipset Machine DH-G200 For Chipset Reballing photo-1
US$ 3,800 - 5,000 MOQ: 1 Piece
Key Specifications
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Place of Origin:
Guangdong, China
Brand Name:
DINGHUA
Model Number:
DH-G200
Payment & Shipping
Payment Methods:
Port of Shipment:
Shenzhen
Delivery Detail:
Delivery time depends on order quantity.
Place of Origin Guangdong, China
Brand Name DINGHUA
Model Number DH-G200
Voltage AC220V, 50/60HZ
Current N/A
Rated Capacity N/A
Rated Duty Cycle N/A
Dimensions 55x58x72cm
Weight 60KG
Usage BGA rework station, laptop motherboards repair, soldering and desolder
Certification CE, ISO9001
After-sales Service Provided Engineers available to service machinery overseas

Specifications

1.Repair Motherboard Chipset Machine
2.CCD camera optical alignment
3.Laser positioning
4.Temperature accuracy
5.CE, ISO9001

Repair Motherboard Chipset Machine DH-G200 For Chipset Reballing

 

Product show:

Repair Motherboard Chipset Machine DH-G200 For Chipset Reballing

CCD camera optical alignment, max camera magnification 200x:

Repair Motherboard Chipset Machine DH-G200 For Chipset Reballing

Laser positioning and scaleplate:

Repair Motherboard Chipset Machine DH-G200 For Chipset Reballing

BGA angle adjust and fine-tune.Accurate positioning makes 98% rework rate:Repair Motherboard Chipset Machine DH-G200 For Chipset ReballingRepair Motherboard Chipset Machine DH-G200 For Chipset Reballing

Bottom hot air heater and IR plate. Portable drawer-style HD touch screen:

Repair Motherboard Chipset Machine DH-G200 For Chipset Reballing

Specification:

Product nameRepair Motherboard Chipset Machine
Total power5300W
Top hot air heater1200W
bottom heaterbottom hot air heater 1200W, IR preheater 2700W
PowerAC220V, 50/60HZ
Temperature accuracy±2°C
PositioningV-groove, PCB support can be adjusted in X,Y direction and equipped with the external universal fixture
PCB sizemin 22x22mm, max 440x380mm
BGA chips2x2mm-80x80mm
Minimum chip spacing0.15mm
External temperature sensor1(optional)
N.W.60kg
Dimension55x58x72cm
Suitable motherboardsmobile phone, laptop, desktop, PS3, XBOX360, game comsole, TV, etc
Features

1.CCD camera optical alignment

2.98% rework rate

3.laser positioning

4.PLC control

Accessories

-1 piece user guide

-1 piece CD

-1 piece LCD display

-1 piece brush

-1 piece temperature sensor

- 5 pcs hot air  titanium alloy nozzle: top nozzle 3pc(31x31mm,38x38mm,41x41mm), Bottom nozzle 2pcs (34x34mm,55x55mm)PS: Hot air nozzle size can be customized according to your chip size

-1 set of vacuum slot including 4 sizes

-3 pcs vacuum sucker

-6 pcs universal fixture

-6 pcs plug knob

-4 pcs supporting screw

Main feature:

1.Embedded Industrial PC, high definition touch screen interface, PLC control, and instant profile analysis function. Real-time settings and actual temperature profile display can be used to analyzed and correct parameters if necessary.

2.It uses precise K-type close circuit control and automatic temperature adjustment system, with temperature module to enable precision temperature control of ±2 deg C. External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile.

3.V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board

4.Flexible and convenient removable fixture on the PCB board which protectsand prevent damage to PCB. It can also adapt to rework various BGA packages.

5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement

6.Three temperature areas can independently heat and are multiple controllable and adjustable to ensure best integration of different temperature areas. Heating temperature, time, angle, cooling and vacuuming can all be set on the interface

7.There are 6-8 levels of variable and constant temperature controls. Massive storage of temperature curves which are Instant accessible according to different BGA. Curve analysis, setting and adjustment are all accessible via touch screen

8.accurate and precise temperature control

9.It uses high powered blower to enable fast cooling of PCB board and prevent it from deformation. There are also internal vacuum pump and external vacuum pen to assist with fetching the BGA chip.

10.Including Voice "early warning" function. 5-10 seconds before the completion of uninstalling or welding, voice reminder / warning to get the workers prepared. Cooling system will start after vertical wind stopped heating. When the temperature drops to room temperature, the cooling process will stop, so that the machine will not age after heated up.

11.CE certification, with emergency switch and automatic power-off protection device when emergency happens

Accessories:

Repair Motherboard Chipset Machine DH-G200 For Chipset Reballing

Repair Motherboard Chipset Machine DH-G200 For Chipset Reballing

Packing:

Repair Motherboard Chipset Machine DH-G200 For Chipset Reballing

Factory:

Repair Motherboard Chipset Machine DH-G200 For Chipset ReballingRepair Motherboard Chipset Machine DH-G200 For Chipset ReballingRepair Motherboard Chipset Machine DH-G200 For Chipset Reballing

CE and ISO9001 certificate:

Repair Motherboard Chipset Machine DH-G200 For Chipset ReballingRepair Motherboard Chipset Machine DH-G200 For Chipset Reballing

Payment:

We can accept Western Union, PayPal, T/T payment. If you want other payment methods, please kindly inform us.

Shipping: 

1. The machine can be delivered by DHL, FedEx, TNT, EMS, UPS.

2. By sea or by air. Please provide us your nearest port.

3. The delivery date is within 7 days after the receipt of payment. If you are in urgent need of it, please kindly tell us.

Warranty:

1.All the machine will be well tested for 3 days before sending.

2.The whole machine is for 1-year warranty, the heating wire is for 3-years warranty

 

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Business Type
Manufacturer
Year Established
2011
Factory Size
1,000-3,000 square meters
Annual Export Value
US$2.5 Million - US$5 Million