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Help CenterDinghua Soldering Machine Bga Rework Machine for Notebook/tablet Motherboard Chip Repair DH-A06
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Dinghua soldering machine bga rework machine for Notebook/tablet motherboard chip repair DH-A06
Specification:
Total Power |
3200W |
Top heater |
800W |
Bottom heater |
2400W |
Power |
AC220V±10% 50/60Hz |
Top head movement |
Up / down, frontward / backward, rotate freely. |
Lighting |
Taiwan led working light, any angle adjusted. |
Storage |
Store 10 groups of temperature profile |
Positioning |
V-groove, PCB support can be adjusted in X, Y direction with external universal fixture |
Temperature control |
K Sensor, Closed loop |
Temp accuracy |
±2℃ |
PCB size |
Max 280mm*460mm Min20mm*20mm |
BGA chip |
5*5~55*55 mm |
Minimum chip spacing |
0.15mm |
External temper sensor |
1pc |
Dimensions |
L470*W490*H600 mm |
Net weight |
Approx 27KG |
1.Two temperature heating zones, top hot air, bottom IR preheating area, digital panel meter controller. And with PID controller to ensure machine temperature more accurate and stable.
2.Uses high precise k-type thermocouple closed-loop control and PID automatic temperature compensation system, temperature deviation on ±2℃. Meanwhile, external temperature measurement connector enables temperature diction and accurate analysis of real time temperature curve.
3.PCB can be adjusted in X, Y direction with “5 point support” + V-groove pcb bracket + universal fixtures, rapidly, accurate positioning.
4.V-groove PCB works for rapid, convenient and accurate positioning, which can suitable for all kinds of PCB board positioning.
5.With different size of magnet nozzles, easy replace and install, rotate freely 360°, any size can be custom if need.
6.6-8 segments temperature can be set for top heating and lower heating(up to 16 segments). 10 groups of temperature curves can be stored, which can number, modification and apply at any time according to different BGA.
7.With Voice warning 5-10 seconds before heating finish: remind operator to pick up bga chip on time. After heating, manual turn on fan to cool down for machine and pcb, when temperature cool down to room temperature ( <45℃ ), turn off cooling fan.
8.CE certification approval. Double protection: Overheating guard + emergency stop function.
Detail pictures:
About Packing and shipping:
Shipping
1. The machine can be delivered by DHL, FedEx, TNT, EMS, UPS.
2. By sea or by air. Please provide us your nearest port.
3. The delivery date is within 7 days after the receipt of payment. If you are in urgent need of it, please kindly tell us.
Payments
We can accept Western Union, PayPal, T/T payment. If you want other payment methods, please kindly inform us.
Warranty
1.All the machine will be well tested for 3 days before sending.
2.The whole machine is for 1-year warranty, the heating wire is for 3-years warranty
Certifications :
About us:
FAQ:
Why bga can't solder on pcb?
There are two factors:
1. if Part of it can't solder, most likely that bga do not align with pcb perfectly.
2. if whole one can't solder, it is because heating temperature too low for it, you will need to raise temperature or prolong heating time.
What cause bubble on bga or pcb?1. Moisture on pcb and bga will cause bubble when heating, so dry them with oven before soldering / desoldering.
2. Temperature too high for them. Lower temperature or shorten heating time.
Can solder ball reuse?
Solder balls should not be used again once they touch flux. Because they will easily stick together once touch flux.
What is melting point of solder balls?
- Lead solder ball: 180℃ - 185℃
Lead-free solder ball: 210℃ - 230℃
What circumstances to use solder paste and solder balls?
1. Solder paste is suitable for reballing of small electronics, such as mobile,
digital camera, small gaming console, etc. That's because bga chip, pcb pad, chip
spacing and solder balls of them are all quite small. Solder paste will be forming balls on bga more easily.
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