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Help CenterManual Bga Rework Station Reballing Heater With Optical Alignment Sysem for Vga Bga Repair DH-G200
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Manual bga rework station reballing heater with optical alignment sysem for vga bga repair DH-G200
Specification of DH-G200 :
Total Power | 5300W |
Top heater | 1200W |
Bottom heater | 2nd 1200W, 3rd IR heater 2700W |
Power | AC220V±10% 50Hz |
Top hot air speed | Can be adjusted with adjusting knob |
Operation mode | Manual operate, HD touch screen, intelligent man-machine, digital system setting |
Optical CCD camera lens | Frontward / backward |
Bga positioning | Laser positioning, fast and accurate position of pcb and bga. |
Camera magnification | 10x - 220x |
Workbench fine-tuning: | ±15mm forward/backward, ±15mm right/left |
Placement accuracy: | ±0.01mm |
Lighting | Taiwan led working light, any angle adjustable |
Temperature profile storage | 50000 groups |
Positioning | Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groov pcb bracket + universal fixtures. |
Temperature control | K sensor, close loop |
Temp accuracy | ±1℃ |
PCB size | Max 390×400 mm Min 22×22 mm |
BGA chip | 2x2 - 80x80 mm |
Minimum chip spacing | 0.15mm |
External temper sensor | 1pc |
Dimensions | L610×W570×H750 mm |
Net weight | 60KG |
Feature of DH-G200:
1.Embedded industrial PC, high definition touch screen, make the operation humanity, CPU control, and instant curve analysis function. Real-time display settings and actual temperature curve, which can also be used to analyze and correct the curve if necessary.
2.It uses high precise k-type thermocouple closed-loop control and automatic temperature compensation system, with CPU and temperature module to enable precise temperature deviation to add and subtract 2 degrees. Meanwhile, external temperature measurement connector enables temperature diction and accurate analysis of real time temperature curve.
3.V-groove PCB works for rapid, convenient and accurate positioning, which can meet all kinds of PCB board of positioning.
4.Flexible and convenient removable fixture on the PCB board can protect the PCB fringe devices from damaging and transmuting. It can also adapt to various BGA ‘s reworking.
5.Various sizes of BGA alloy nozzles, which can be adjusted 360 degree for easily installation and replacement.
6.Three temperature areas can independently heat and they are multiple temperature control, which can ensure best integration of different temperature areas. Heating temperature, time, slope, cooling and vacuum can all be set in the human-machine interface.
7.There are 8 stage temperature controls up and down. Massive storage of temperature curves which are accessible at any time according to different BGA. Curve analysis, setting and adjustment are also accessible via touch screen. Three heating areas adopt independent PID calculation to control heating process to enable more accurate temperature.
8.It uses high power cross-flow fan to enable fast cooling of PCB board and prevent PCB from deformation. There are also internal vacuum pump and external vacuum chuck, which can help to fetch the BGA chip;
9.Collocating with sound control "early warning" function. It can warn workers to make some relative preparation 5-10 seconds before the completion of uninstalling or welding. Cooling system will start after vertical wind stopped heating. When the temperature drops to normal temperature, the cooling process will stop automatically, so that the machine will not be aging after temperature heated up.
10.It use rocker controller for controlling the upper heater go up and down freely, and it also has the function for zooming the picture.
structrue of DH-G200:
Certification:
Our company:
| Our reception | Our showroom |
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| Our workline | Our team |
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Our customer:
FAQ:
Why bga can't solder on pcb?
There are two factors:
1. if Part of it can't solder, most likely that bga do not align with pcb perfectly.
2. if whole one can't solder, it is because heating temperature too low for it, you will need to raise temperature or prolong heating time.
What cause bubble on bga or pcb?
1.Moisture on pcb and bga will cause bubble when heating, so dry them with oven before soldering / desoldering.
2.Temperature too high for them can cause bubble as well. Lower temperature or shorten heating time.
Can solder ball reuse?
Solder balls should not be used again once they touch flux. Because they will easily stick together once touch flux.
Our application:
Complete range of rework applications in medium and large scale service centers
Mobile and radio systems devices repairment
Smart phones, PDAs, handhelds, laptops, notebooks & motherboards repairment
LAN devices, network nodes and military communication equipment repairment
Portable medical equipment repairment
Warranty and after-sale service:
1. We provide you the friendly English User manual for free.
2. Videos of operating the machine are available.
3. 24 hours technical support by email or calling. We promise to response in 3 minutes, solve the problems in 24 hours.
4. Warranty: 1 year free for the whole machine, 3 years free for the heaters and free life long for technical support always.
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