Dinghua bga disoldering soldering machine repairing chipsets ic DH-A4

Dinghau bga disoldering soldering machine repairing chipsets ic DH-A4

Every part's description

1. Specifications.

2. Features:

a.       Embedded with industrial PC and Windows OS, high definition touch screen interface, Real-time temperature monitoring and start-up password for protection and modification. It can display 4-6 temperature profiles simultaneously and store multiple sets of user data with instant profile analysis function. Real-time settings and actual temperature profile display can be used to analyze and correct parameters if necessary.

b.       With heating system and mount head unifying structural design, PLC controls, stepper motor drives and lead screw driven, the linear slide provides X,Y and Z with precision alignment and fast positioning, realizing the dismantling, mounting and soldering processing with intelligent control, providing automatic dismantling and soldering functions.

c.      The machine uses independent temperature controller for three temperature zones, and fluctuation hot-air, bottom infrared. Heating time, temperature and curve are all displayed on the touch screen.

d.       This machine uses high precise K-type thermocouple closed-loop control and automatic temperature compensation system. It combines with PLC and temperature module, which enable precise temperature deviation to add and subtract 2 degrees. Meanwhile ,external temperature measurement connector enables        temperature diction and accurate analysis of real time temperature curve.

e.       The PCB board uses V-groove for rapid, convenient and accurate positioning, so that it can fit for all kinds of PCB board.

f .       Flexible and convenient universal clip on the PCB board can protect the PCB fringe devices from damaging and deformation. It can also adapt to various BGA ‘s reworking.

g.        Various sizes of BGA alloy (nozzles) nozzles, which can be adjusted 360 degree for easily installation and replacement.

h.       First, this machine uses high definition adjustable CCD optical registration system. Second, it has the function of Spectral double color,enlargement,micro adjustment,auto-focus and auto-correction. Besides, it is equipped with automatic chromatic aberration resolution and adjustable brightness systems. In the process of counterpoint, you can move the optical lenses in any directions freely, observe the counterpoint condition of BGA chip, so that we can ensure the accuracy and avoid observation blind Angle.

i .     X,Y axis and R angle use are adjustable by micrometer with accuracy of positioning up to ± 0.01MM ,and equipped with high-definition display screen, which can eliminate human operation errors.

j .       Eight segments temperature rise or reduction control and 8 segments constant temperature control, which can store huge temperature curves. Curve analysis, setting and correctness can all be done on the touch screen.

k .      Collocating with sound control "early warning" function. It can warn workers to make some relative preparation 5-10 seconds before the completion of uninstalling or welding. Meanwhile, it adopts high flow fan for cooling the PCB board automatically or manually. Besides, it can prevent the PCB board from deformation and ensure the welding effect.

l.       Internally installation vacuum pump, X angle cans up to 60 degrees. Micrometer mounting nozzle is high-precise; no air supply is required.

m.     With CE certification,  equipped with emergency stop switch and automatic power-off protection device when emergency happens.

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  The company profile

Our technicians from Germany

The large international companies cooperating with us

some of our certificates

Should you have any question, please contact us:

whatsapp/Tel: +86 15768114827

Skype ID: sinobga32

Email address: sales32 @dinghua-bga.com