Home > Products > Soldering Station > Infrared BGA rework station for mobile repairing/Automatic bga rework station with factory price
Infrared BGA rework station for mobile repairing/Automatic bga rework station with factory price
- 100 Set / Sets per Month
- Shenzhen
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Product Details
| Place of Origin: | Guangdong, China | Brand Name: | FEITA | Model Number: | CF-360 |
| Voltage: | 110V / 220V | Current: | 50HZ / 60HZ | Rated Capacity: | 2400W |
| Rated Duty Cycle: | 90% | Dimensions: | 760mm(L) * 700mm(W) * 600mm(H) | Weight: | 36KG |
| Usage: | Repair | Certification: | ROHS | After-sales Service Provided: | Overseas third-party support available |
Product Description
Infrared BGA rework station for mobile repairing/Automatic bga rework station with factory price
Model | CF360 |
Solder Type | Lead/Lead free |
SMD Type | Micro bga,BGA,CSP,QFP |
PCB Thickness | 0.5mm~4mm |
PCB Size | W50*D50~W455*D350mm |
Heating Mode/Power(Upper) | Hot-blast air /800W |
Heating Mode/Power(Bottom) | Hot-blast air /800W |
Preheating Mode/Power | IR 2400W |
PCB Location Mode | Shape or Tongs |
Drive Mode | Gear,Rack |
Control/Adjusting Mode | Touch Screen + PLC |
Temperature Range | Room Temperature 0~400℃ |
Max Power | 4000W |
Supply Voltage | 110V / 220V |
Machine Dimension | 760mm(L) * 700mm(W) * 600mm(H) |
Machine Weight | 36KG |
Sketch map of upper mandril mounting to limit height
1.Packing: indivually packed , standard export package
2.Delivery Detail: Within 3-5 workdays delivery after confirming the payment.
3.Shipping & order :
1. Any inquire can be replied within 24 hours.
2. we are professional manufacturer,welcome to visit our website.
3. All of our products 100% inspection before delivery, we guarantee to use our products safely.
4. We own the best after-sale service.If there are any problems, our team will do our best to solve for customers.
1. The cleaning work in BGA welding
Steel mesh is suggested to clean by the dedicated washing-board water and sonicleaning. Solder used once is not advised to recycle. Once infected in some invisible dust or little welding paste, will make big trouble on next solder-distribution. Suggest to use non-dust cloth and washing-board water to clean PCB. After solder-distribution, don’t touch solder by hands, once infected in sweat or oil stain, also can result in welding fail.
Remember:Details decide success or fail.
2. How to take down the chips with glue?
If the measured temperature by temperature measuring wire on BGA chip’s bottom is 230℃, then the solder has melted.
But why still can’t take down chips by tweezers as the common ways? Since there is glue connecting with chip, so we must take down chips with more strength. But if the solder will fall from chip? No. Because the solder on pad has melted to liquid, but glue is poured between solder, no sticking on pad, so the solder will not fall even taking down strongly.
But we must pay more attention to the laying place of temperature measuring wire’s position:
Contact Us
- Dongguan Feita Electronics Co., Limited
- Contact nameLily Tian
- Phone0086-769-82110359
- AddressSouth Avenue,Zhangmutou town Dongguan,Guangdong
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