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Sapphire Wafer Cutting Machine
UV Laser Cutting machine is high-end precision processing equipment to cut LED Sapphire and sapphire substrate epitaxial wafer .
UV Laser Cutting machine 's Application:
@Display backlight
@Car
@ Business decorative landscape lighting road lights
@ Home decorative lighting products
@System controller:LED screen,LED outer
Character of UV Laser Cutting machine :
1.One-button operation, fully automatic operation
2.High-precision linear motion platform(imported)
3.Marble working table
4.Adjust Focal length automatically
5.CCD Auto-image identify & positioning system, face & back cutting
6.Anti-coarsening visual system
7.Identify Software template automatically, angle correction, auto seek& correct contour
8.High reliability, low maintenance&operating cost
9.Software correct automatically,bar code read, product data record
LED Sapphire UV laser cutting machine |
||
Type |
UV laser cutting |
|
Cutting size |
2”,4” |
|
Laser type |
Semicon solid laser Adjust Q |
|
Laser wavelenght |
355nm |
|
System |
X-Y repeated precision |
≤±0.5um |
X-Y repeated Positioning |
≤±1um |
|
Q axis |
15 arc-sec |
|
Range travel |
X-Y axis |
200mm |
Z axis |
20mm |
|
Cutting depth |
20-30um |
|
Cutting speed |
80-130mm/s |
|
Cutting linear width |
8um |
|
Ambient temperature |
20-25C |
|
Relative humidity |
20%-60% |
|
air compression |
0.5-0.8mpa |
|
Power |
220V/15A/50-60HZ |
|
Machine size |
1200*1100*1600mm |
|
Machine Weight |
1000KG |
|
level of automation |
Automatic Fully |
|
Control System |
PC control |
|
Sample:
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