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6L Printed Circuit Board Manufacturing Process With Blue Soldermask

Name: 6L Printed Circuit Board Manufacturing Process With Blue Soldermask
Brand: RayMing
SKU: 119066149
Availability: InStock

US$ 1 - 50 MOQ: 30 Pieces

Key Specifications

Place of Origin:

Guangdong, China

Brand Name:

RayMing

Model Number:

PCB0329

Shenzhen Rayming Electronic Co., Ltd.

Payment & Shipping

Payment Methods:

Port of Shipment:

Shenzhen

Delivery Detail:

Delivery time depends on order quantity.

Place of Origin Guangdong, China

Brand Name RayMing

Model Number PCB0329

Number of Layers 6-Layer

Base Material Rogers

Copper Thickness 1oz-6oz

Board Thickness 0.2-8.5mm

Min. Hole Size 0.2mm

Min. Line Width 0.1mm

Min. Line Spacing 0.1mm

Surface Finishing ENIG

Welcome to RayMing Technology!!!

Any question,pls contact Nail Ding freely.

Primary Competitive Advantages:

Printed Circuit Board,China PCB,PCB Manufacturing,PCB Manufacturers,express PCB, PCB Prototypes,PCB Prototyping,Prototype PCB.Lead Free HASL PCB

rigid board,FPC,Flexible Printed Circuit,flex board, PCBA,pcb facture ,pcb design,pcb layout,pcb assembly, copy pcb.

pcb maker,quick turn pcb, multilayer pcb, high multilayer pcb, circuit board, hf pcb, hdi pcb, pcb, teflon pcb

-Lead free HASL Surface finish required to meet ROHS compliant

-FR4 material with 0.2mm-3.2mm boards thickness

-Copper weight:0.5OZ,1OZ,2OZ,3OZ

-4-4mils track width spacing

-0.2mm min finished hole size

-Certificate: UL, ROHS, T/S16949 -Company management: ISO9001:2000 -Markets: Europe, America, Asia

Factory Manufacture Capability.

Item	Manufacture Capability
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based
Layer No.	1-16
Finished Board thickness	0.2 mm-3.8mm’(8 mil-150 mil)

Board Thickness Tolerance	±10%
Cooper thickness	0.5 OZ-11OZ (18 um-385 um)
Copper Plating Hole	18-40 um
Impedance Control	±10%
Warp&Twist	0.70%
Peelable	0.012"(0.3mm)-0.02’(0.5mm)
Images
Min Trace Width (a)	0.1mm (4 mil)
Min Space Width (b)	0.1mm (4 mil)
Min Annular Ring	0.1mm (4 mil)
SMD Pitch (a)	0.2 mm(8 mil)
BGA Pitch (b)	0.2 mm (8 mil)

Solder Mask
Min Solder Mask Dam (a)	0.0635 mm (2.5mil)
Soldermask Clearance (b)	0.1mm (4 mil)
Min SMT Pad spacing (c)	0.1mm (4 mil)
Solder Mask Thickness	0.0007"(0.018mm)
Holes
Min Hole size (CNC)	0.2 mm (8 mil)
Min Punch Hole Size	0.9 mm (35 mil)
Hole Size Tol (+/-)	PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol	±0.075mm
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel 3-7um Au:1-5u''
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	CNC: ±0.125mm, Punching: ±0.15mm
Beveling	30°45°
Gold Finger angle	15° 30° 45° 60°
Certificate	ROHS, ISO9001:2008, SGS, UL certificate