2 layers 4oz for power supply

ITEM

PRODUCTIVE CAPABILITY

Layer

1-24

Produces Type

HF(High Frequency)& buried ,blind board, Impedance controlled board ,HDI board ,BGA Thicker Copper (Up to 10 OZ)board

Material

FR4(Shengyi China,ITEQ,Nanya ), Rogers, Telflon,etc. aluminum,Polyimide

Finished Surface

HASL, leadfree HASL, ENIG(Immersion Gold), Immersion Tin, Immersion Silver, Hard Gold, Plating Gold, Gold Finger, OSP

Minimum Line Width/Space

3.5/4mil

Minimum Hole Size

0.15mm(Mechanical Drill);

0.1mm(Laser Drill)

Minimum Annular Ring

4mil

Max Copper Thickness

10 OZ 

Max Production Size

700×1200mm

Board Thickness

D/S: 0.2-7.0mm;

Multilayers:0.40-7.0mm

Plugging Vias Capability

0.2-0.8mm

Board Thickness Tolerance

Thickness≤1.0mm:+/-0.1mm;

1.0mm——2.0mm:+/-10%;

Thickness≥2.0mm:+/-8%

Hole Size Tolerance

PTH:+/-3mil;

NPTH:+/-2mil

Certificate

ISO9001:2008, RoHS, UL certificate, ISO14001