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Help Center3.0 W/m.k Thermal Conductive Pad ,electric Insulation
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Silicone thermal conductive pad with nature tack for CPU, GPU, VGA, CMOS chip. Thermal Gap Filler Pad is designed to be used in the applications that require the minimum amount of pressure on components and moderate thermal conductivity. Leader supplies Thermally Conductive pads and in standard and made-to-drawing configurations from a variety of Gap Filling products. We offer the softest, most thermally conductive pad available (thickness ranging from 0.5mm to 5.0 mm and above).
Features&Benefits:
-Thermal conductivity:3.0w/m.k
-High thermal performance at cost effective
-Slightly tacky on both sides
-Low stress application
-Electrical isolating
Configurations:
-Sheet form,die-cut parts
-Tape application available
Size available:
200x400mm
Thickness available:
0.5-5.0mm,increment by 0.5mm
Thermal Conductive Pad LD8300 and Other Series Properties:
| Property | Unite | LD8100C | LD8100+F100 | LD8150 | LD8200 | LD8250 | LD8300 | Test method |
| Color | *** | White Grey | Pink&White | Dark Grey | Dark Grey | Yellow | Blue | Visual |
| Thickness | mm | 0.3-12.0 | 0.5-15.0 | 0.5-10.0 | 0.5-10.0 | 0.5-5.0 | 0.5-5.0 | ASTM D374 |
| Density | g/cc | 1.8 | 2 | 2.5 | 2.8 | 3 | 2.7 | ASTM D792 |
| Hardness | Shore C | 30±5 | 15±5 | 25±5 | 25±5 | 25±5 | 25±5 | ASTM D2240 |
| Tensile Strength | KN/m | 0.85 | 2.5 | 0.47 | 0.33 | 0.42 | 0.29 | ASTM D412 |
| Continuous Use Temp | ℃ | -40~150℃ | -40~150℃ | -40~150℃ | -40~150℃ | -40~150℃ | -40~150℃ | EN 344 |
| Electrical | ||||||||
| Breakdown Voltage | Kv/mm | ≥6.0 | ≥6.3 | ≥5.2 | ≥6.0 | ≥5.3 | ≥4.8 | ASTM D149 |
| Volume Resistivity | Ω.cm | 1.2x1011 | 6.2x1015 | 8.0x1015 | 1.0x1016 | 3.2x1016 | 3.2x1016 | ASTM D257 |
| Flame Rating | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | UL 94 |
| Thermal | ||||||||
| Thermal conductivity | W/m.k | 1 | 1 | 1.5 | 2 | 2.5 | 3 | ASTM D5470 |
Remark: 1,Date for design engineer spec.Reference only.Engineers are remind to test the material in application. 2,The other thermal conductive pad series have different application areas,the best thermal management solutions,please contact Leader Team.
| ||||||||
1,Thermal conductive pad LD8300 is naturally tacky.
2,requiring no adhesive coating to inhabitthermal performance.
3,It can also be with a rubber-coated fiberglass carrier becoming one side tacky
and no tacky on other side to allowing easy material handing and installation.
Typical Application Includes:
-High power applications
-Notebook computers
-Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
-Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
-Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
Send your inquiries for quotation now,get the free samples!
Send Inquiry to This Supplier
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