High TG Printed Circuit Board
Specifications
* Print circuit board design and assembly ;* Single layer and multiple layers board;
* Strict quality system
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
| layer | 1-8 layer |
| Material type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free |
| Board thickness | 0.8mm to 3.0mm |
| Copper thickness | 0.5 OZ to 3 oz |
| Size | Max. Board Size: 580mm×1100mm |
| Min. Drilled Hole Size: 0.2 mm (8 mil) | |
| Min. Line Width: 4mil (0.1mm) | |
| Min. Line Spacing: 4mil (0.1mm) | |
| Surface finishing | HASL / HASL lead free, HAL, Chemical tin, Immersion Silver/Gold, Gold plating |
| Solder Mask Color | Green/Yellow/Black/White/Red/Blue |
| Tolerance | Shape tolerance: ±0.13 |
| Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
| Certificate | ISO 9001, ISO 14001 |
When send us inquiries. Please also provide below information:
1) Board layer: such as single layer, double sided layer, 4-layer...
2) Board type: such as FR4 1.6mm
3) Copper line thickness: such as 35umm (1oz)
4) Solder mask: such as Green solder with white silk screen
5) Surface treatment: such as Tinned with lead, Tinned with lead free, Gold Plating...
Send Inquiry to This Supplier
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